IONTECH
®
IT-DS EDI Modules
4.3 Cleaning and Chemical Sanitization Procedures
• Avoid direct skin contact with cleaning chemicals. Wear safety
glasses and protective clothing.
• Pressure test the cleaning skid with water before adding
• Flush all hoses and tank with clean water BEFORE adding
• To reduce the possibility of chemical sprays, relieve the pressure
in chemical lines before disassembly.
• Follow the manufacturer's chemical safety instructions on the
• Check the pH level in any solution before letting it flow to the
drain. Follow all discharge limitations.
Do not run a cleaning solution through the system when DC power is
applied to the module. Make sure the DC power is off before cleaning.
The system can be cleaned and sanitized with any of five (6) different solutions, depending on
what needs to be removed:
• Hydrochloric acid (2%) - For removing scale and metal oxides.
• Sodium chloride/sodium hydroxide (5% brine/1% caustic) - For removing organic
• Sodium percarbonate - For removing organic foulants, reducing pressure drop, and
• Peracetic Acid - Used for routine sanitizing to discourage the growth of bacterial
• Aggressive Multi-Agent cleaning for Biofilm- Recommended for general biofouling with
increase in pressure drop. This aggressive cleaning protocol consists of 5% sodium
chloride followed by a 2% sodium hydroxide and then followed by a 1% sodium
percarbonate with a final 5% sodium chloride flush. The combination of these treatments
performed sequentially has proven to be more effective than any single treatment
• Aggressive Multi-Agent cleaning for Fouling/scaling - Recommended for fouling and
scale remediation with drop in performance combined with increased electrical stack
resistance. Aggressive sequential cleaning protocol of salt (5% sodium chloride) then
followed by caustic (2% sodium hydroxide) followed by acid (2% hydrochloric acid) with a
final 5% sodium chloride flush (see Service Bulletin 2007-02). Extended soaking or
increasing the acid concentration in the range from 2%-4% HCl based on the severity of
electrical stack resistance increase increases the benefits of this treatment.
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