Kirisun DM588 - Page 67

DM588 Service Manual
SN
Material NO
Material Name
Specifications
QTY
Component NO
KR
transistor
encapsulation
76
1IS1-LMX2571NJK
T
Phase-locked loop IC
Brand: Texas Instruments; model:
LMX2571NJKT; encapsulation: 36PIN
WQFN
1 IC7
77
1TC1-UMC4
R SMD Darlington tube
UMC4, NPN/PNP
2
IC10,IC14
78 1IS1-OPA348 Operational amplifier OPA348, SC70-5 encapsulation 2 IC11,IC12
79 2LW1-25UC-471K
R SMD wire wound
inductor
2520, 0.47μH±10%, ceramic core
(FLM2520-R47K)
2 L8,L40
80 2LW1-16UC-R33G
SMD wire wound
inductor
1608, 330nH±2% (C1608BR33G), lead
free
18
L9,L12,L13,L14,L18,L19,L20,L23,L24,L26,R22,L5
0,L51,L56,L57,L59,L70,L71
81 2LW1-20UC-150J
SMD wire wound
inductor
2012,15nH±5%, ceramic core
(C2012C-15NJ)
1 L10
82 2LW1-20UC-8R2J
SMD wire wound
inductor
2012,8.2nH±5%, ceramic core
(C2012C-8N2J)
1 L11
83 2LW1-16UC-181J
SMD wire wound
inductor
1608,180nH±5%, ceramic core
(C1608CB-R18J)
2 L15,L47
84 2LW1-20UC-390GA
R SMD wire wound
inductor
2012,39nH±2%, ceramic core
(C2012C-39NG)
1 L16
85 2LW1-20UC-120GA
SMD wire wound
inductor
2012 (0805),12nH±2%, Sagami,
ceramic core
1 L17
86 2LW1-16UC-120G
SMD wire wound
inductor
1608, 12nH±2%, ceramic core
(C1608CB-12NG)
4 L21,L32,L58,L60
87 2LL1-16-4R7KA
Multi-layer chip
inductor
1608, 4.7μH±10%
(SDFL1608Q4R7KTFB01), SunLord
1 L22
88 2LL1-16-1R0KB
Multi-layer chip
inductor
1608, 1μH±10%
(SDFL1608Q1R0KTFB02), SunLord
2 L25,L54
89 1TT1-BFU550A RF triode BFU550A, NXP, SOT23 encapsulation 3 Q3,Q104,Q8
90 1TT1-2SC4617-R R SMD triode 2SC4617-R(BR), EMT3 1 Q4
91 1TT1-SSM3J15FS Switch triode SSM3J15FS, PMOS 1 Q5
64