Kirisun DM588 - DM588 Radio Structural Component Material Lists; DM588 Front Housing Assembly Material; DM588 Front Housing Assembly; DM588 Plastic Front Housing Details

DM588 Service Manual
SN
Material NO
Material Name
Specifications
QTY
Component NO
connection terminal
228 1IS3-TDA1519CB
ER audio power
amplifier
UTC, TDA1519C, SIL9, with pins 1 IC5
229 3CL3-PH-20002 R bar connector
Socket, PH type, spacing 2MM,
2-core/WCPW20-02
1 J2
Table 4 Material List of DM588 LCD Board
SN
Material NO
Material Name
Specifications
QTY
Component NO
1 0SS2-4291-HFB Plug-in nesting for LCD board LT1901 scheme 1
2 3CC3-2R00207-J1 Pin header 2*7P
Pin header 2.0, double plastic 2*7P,
L10.5MM, 3.5/4.0/3.0
1 J1
3 2RW3-RE1101CA1-H01-3
Volume knob (for models DM890
and DR650)
360° rotatable, with push-button switch
encoder, RE1101CA1-H01-3105,
Linjiwei brand, lead free
1 S13
4 3CC3-16MB-Y10J KME231 aerial socket
Zinc alloy, 16M-B, 10-pin connector,
lead free
1 J2
5 7GCJ-4291-01A
Insulative rubber pad for hand
microphone interface
0.10mm thick yellow insulative paper,
circular shape, φ19.5/φ10.5,
single-sided adhesive, Xinlongda brand
1 J2 insulative pad
6 6SS1-4291-HFC SMD nesting for LCD board LT1901 scheme 1
7 2CC1-10-X7R500-102K R multi-layer chip capacitor 1005, 1000P±10%, 50V, X7R 38
C1,C2,C3,C4,C5,C6,C7,C8,C9,
C10,C11,C12,C13,C14,C15,C16
,C17,C18,C19,C20,C21,C22,C2
3,C24,C25,C26,C27,C28,C29,C
30,C33,C34,C35,
C305,C446,C447,C516,C517
8 2CC1-16-C0G500-101J R multi-layer chip capacitor 1608, 100P±5%, 50V, C0G 4 C31,C306,C328,C329
90