Lantronix Qualcomm HDK8450 - Page 12

HDK8450 (SM8450P) Processor User Guide Main board
80-28453-2 Rev. C Confidential – Qualcomm Technologies, Inc. and/or its affiliated companies – May Contain Trade Secrets 12
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
Subsystem /
Connectors
Feature Set
Description
Specification
PM8450
The PM8450 device integrates most of the wireless
product’s power management, general housekeeping, and
IC-level interface support functions into a single mixed-
signal IC.
▪ PM8450 is optimized for the SM8450 chipset.
▪ Six FTS520 SMPS
▪ Four LDO512 linear regulators
▪ Overtemperature protection
▪ SPMI
▪ Four GPIOs
▪ 81-pin fan-out wafer-level pico-scale package
(81 FOWPSP)
PM8350
The PM8350 device integrates most of the wireless
product’s power management, general housekeeping, and
IC-level interface support functions into a single mixed-
signal IC.
▪ PM8350 is optimized for the SM8450 chipset.
▪ Three HFS510 SMPS and nine FTS520 SMPS
▪ 10 LDO512 linear regulators
▪ On-chip ADC
▪ Overtemperature protection
▪ SPMI
▪ 10 GPIOs
▪ 144-pin fan-out wafer-level nano-scale package (144
FOWNSP)
PM8350C
The PM8350C PMIC supplements the core PM8350
PMIC and the slave PM8350B PMIC to integrate all
wireless handset power management, general
housekeeping, IC-level interface, and user interface
support functions into an integrated solution.
▪ PM8350C is optimized for the SM8450 chipset.
▪ Nine FTS520 SMPS and one HFS515 SMPS
regulators
▪ 13 LDO linear regulators
▪ System rail buck-or-boost (BoB) SMPS regulator
▪ RGB LED drivers and camera flash drivers
▪ Overtemperature protection
▪ SPMI
▪ 9 GPIOs
▪ 143-pin fanout wafer-level nanoscale package
(FOWNSP143)
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