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General| Layer Resolution | 0.05-0.3 mm |
|---|---|
| Nozzle Diameter | 0.4 mm |
| Filament Diameter | 1.75 mm |
| Nozzle Temperature | Up to 260°C |
| Bed Temperature | Up to 100°C |
| Connectivity | USB, SD Card |
| Supported Materials | PLA, ABS, PETG, TPU |
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