Disassembly/Reassembly Procedures: Serviceable Components of the Main Sub-Assemblies 7-15
7.4.6 Removal of the Front Kit Assembly (A)
1. Complete the steps in Section 7.4.5.1. and Section 7.4.5.5. through Section 7.4.5.7.
2. With the steps completed, the Front Kit Assembly (A) is obtained.
7.5 Serviceable Components of the Main Sub-Assemblies
7.5.1 Servicing Main Board Assembly
Figure 7-22. Serviceable Components – Main Board Assembly
7.5.1.1 Servicing Coin Cell:
1. Complete steps from Section 7.4.5.1. through Section 7.4.5.3.
2. Remove the coin cell with the Black Stick.
NOTE: Make sure the positive side is facing upwards.
3. Press the new coin cell into the battery carrier until it is secured and fully snapped into place.
7.5.1.2 Servicing Thermal Pad:
1. Complete steps from Section 7.4.5.1. through Section 7.4.5.3.
2. Carefully peel off the pad.
3. Ensure there is no debris or residue left on the amplifier’s surface.
4. Replace with new Thermal Pad.
5. Peel the liner off the new pad and place in the respective location. Make sure the bottom
surface of the pad is mating with the top surface of the amplifier.
6. Apply slight pressure to activate the adhesive.
Thermal pad should always be replaced when the Main board
assembly is removed.
To Next Page
Loading...
Need help?
General
