2
9.
When
replacing a
CMOS
integrated circuit
device, leave
the
device in its metal rail container
or
con-
ductive
foam
until it is
to
be inserted
into
the
printed cir-
cuit module.
10. All low impedance test equipment (such as
pulse generators, etc.) should be connected
to
CMOS
device inputs
after
power is applied
to
the
CMOS
cir-
cuitry. Similarly, such low impedance equipment should
be disconnected before power
is
turned
off.
11. Replacement modules shipped separately from
the
factory will be packaged in a conductive material.
Any
modules being
transported
from
one
area
to
another
should be
wrapped
in a simlar material
(aluminum foil
may
be used).
NEVER
USE NON-
CONDUCTIVE
MATERIAL
for packaging these
modules.
A