Oracle Sun Fire X2270 M2 - Page 30

Component Designations Procedures andTopics
Hard drive backplane assembly
Front I/O board
CPU and heatsink assembly
Motherboard
“Replacing the Hard Drive Backplane Assembly (FRU)” on page 56
“Replacing the Front I/O Board (FRU)” on page 64
“Removing, Installing, and Adding a CPU and Heatsink (FRU)” on
page 67
“Replacing the Motherboard (FRU)” on page 73
Locations of Internal Server Components
Legend
1 DIMM slots (6) for CPU 1 2 CPU 1
3 PCIe riser and card 4 Unsupported component
5 SP board 6 CPU 0
7 DIMM slots (6) for CPU 0 8 Power supply
9 Air duct 10 System battery (located under the air duct)
Locations of Internal Server Components
Sun Fire X2270 M2 Server Service Manual • January, 2012, –1230