User Manual
E712T0010, valid for E-712.N1, E-712.1AM, E-712.1AN, .2AN, .3AN
CMo, BRo, 10/31/2024
Physik Instrumente (PI) SE & Co. KG, Auf der Römerstraße 1, 76228 Karlsruhe, Germany page 33 / 40
Phone +49 721 4846-0, fax +49 721 4846-1019, e-mail info@pi.ws, www.pi.ws
8 Parameters
The table below lists a selection of the parameters which are provided by the PiezoWalk® firmware of the E-
711/E-712 system. For a complete parameter list see the E-712 User Manual (PZ195E). Parameter values can be
changed using the SPA and SEP commands. To have write access to a parameter, it might be necessary to switch
to a higher command level using the CCL command. See the E-712 User Manual for more information on
parameter handling.
Parameter ID
(hexa-
decimal)
Command
Level
for write
Item Type
Concerned
Data
Type
Parameter
Description
Notes
0x07000204 1 PiezoWalk
Channel
FLOAT PiezoWalk Open-Loop
Velocity
[µm/sec.]
Used to calculate the piezo voltage slew
rate, affects the duration of the relax
0x07000900 1 Logical Axis FLOAT ON Target Tolerance Gives the settling window. The settling
window is centered around the axis
target position.
The on-target status of an axis is true
when the current axis position is inside
the settling window and stays there for at
least the settling time (Settling Time
parameter, ID 0x07000901).
If full-step mode is selected for a
PiezoWalk® drive, it is automatically
switched to analog mode when the
current positions of all axes to which the
drive is assigned are inside the settling
window. Switching back to full-step mode
is done automatically when one of the
shearing voltages for that PiezoWalk®
drive reaches the given limit (Soft Voltage
Low Limit, ID 0x0c000000, and Soft
Voltage High Limit, ID 0x0c000001).
Therefore the ON Target Tolerance value
must be smaller than the maximum
possible displacement of the shearing
components (which can be achieved with
the maximum amplitude of the shearing
voltages V
Dmax
– V
Dmin
).
The ON Target Tolerance value
furthermore is used during the iterative
relaxing procedure. See p. 12 for details.