Quectel EG06 Series

LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 9 / 89
FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 72
FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 73
FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ................. 81
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................... 81
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS .................................................................................... 82
FIGURE 44: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 83
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 84
FIGURE 46: TOP VIEW OF THE MODULE ...................................................................................................... 85
FIGURE 47: BOTTOM VIEW OF THE MODULE .............................................................................................. 85
FIGURE 48: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 87
FIGURE 49: TAPE SPECIFICATIONS.............................................................................................................. 88
FIGURE 50: REEL SPECIFICATIONS.............................................................................................................. 88