Quectel EG91-NAXD - Page 93

LTE Standard Module Series
EG91 Series Hardware Design
EG91_Series_Hardware_Design 92 / 106
1.00
1.70
0.70
0.55
0.85
1.00
1.70
1.70
62x0.7
40x1.0
40x1.0
25±0.15
2.75
2.75
3.90
1.15
1.15
7.45
7.15
0.85
8.50
5.10
0.20
1.10
1.90
1.10
1.95
1.00
1.10
1.10
62x1.15
1 . 7 0
1 . 7 0
0 . 4 0
1 . 7 0
1.70
0 . 4 0
0 . 5 0
4 . 8 5
1 . 5 8
0 . 3 3
2 . 9 3
1 . 6 3
5 . 9 5
4 . 2 5
0 . 5 0
29±0.15
Figure 43: EG91-EX Module Bottom Dimensions (Top View)
1. The package warpage level of the module conforms to the JEITA ED-7306 standard.
NOTE