Quectel EM06 Series - Page 7

LTE-A Module Series
EM06 Series Hardware Design
EM06_Series_Hardware_Design 6 / 69
5 Antenna Connection .......................................................................................................................... 44
5.1. Main/Rx-diversity/GNSS Antenna Connectors ......................................................................... 44
5.1.1. Antenna Connectors ...................................................................................................... 44
5.1.2. Operating Frequencies................................................................................................... 45
5.1.2.1. Cellular Operating Frequencies .......................................................................... 45
5.1.2.2. GNSS Operating Frequencies ............................................................................ 47
5.2. Antenna Installation ................................................................................................................... 47
5.2.1. Antenna Requirements .................................................................................................. 47
5.2.2. Antenna Connectors and Mating Plugs ......................................................................... 48
6 Electrical, Reliability and Radio Characteristics ............................................................................ 51
6.1. Absolute Maximum Ratings ...................................................................................................... 51
6.2. Power Supply Requirements .................................................................................................... 51
6.3. I/O Requirements ...................................................................................................................... 52
6.4. Current Consumption ................................................................................................................ 52
6.5. RF Output Power ...................................................................................................................... 58
6.6. RF Receiving Sensitivity ........................................................................................................... 59
6.7. ESD Characteristics .................................................................................................................. 61
6.8. Thermal Dissipation .................................................................................................................. 61
7 Mechanical Dimensions and Packaging ......................................................................................... 63
7.1. Mechanical Dimensions of the Module ..................................................................................... 63
7.2. Standard Dimensions of M.2 PCI Express ............................................................................... 64
7.3. Design Effect Drawings of the Module ...................................................................................... 65
7.4. M.2 Connector ........................................................................................................................... 66
7.5. Packaging ................................................................................................................................. 66
8 Appendix References ........................................................................................................................ 67