Quectel LTE-A Series - Page 6

LTE-A Module Series
EG060V-EA Hardware Design
EG060V-EA_Hardware_Design 5 / 82
3.15. Module Status Indication Interface .......................................................................................... 48
3.16. RI Behaviors ............................................................................................................................ 49
3.17. PCIe Interface* ........................................................................................................................ 50
3.18. WLAN Control Interface* ......................................................................................................... 51
3.19. SD Card Interface*................................................................................................................... 52
3.20. SPI Interface ............................................................................................................................ 54
3.21. USB_BOOT Interface .............................................................................................................. 55
4 Antenna Interfaces ............................................................................................................................. 57
4.1. Main/Rx-diversity Antenna Interface ....................................................................................... 57
4.1.1. Pin Definition .................................................................................................................. 57
4.1.2. Operating Frequency ..................................................................................................... 57
4.1.3. Reference Design of RF Antenna Interface ................................................................... 58
4.1.4. Reference Design of RF Layout..................................................................................... 59
4.2. Antenna Installation ................................................................................................................. 61
4.2.1. Antenna Requirement .................................................................................................... 61
4.2.2. Recommended RF Connector for Antenna Installation ................................................. 61
5 Electrical, Reliability and Radio Characteristics ............................................................................ 63
5.1. Absolute Maximum Ratings ..................................................................................................... 63
5.2. Power Supply Ratings ............................................................................................................. 64
5.3. Operation and Storage Temperatures .................................................................................... 64
5.4. Current Consumption .............................................................................................................. 65
5.5. RF Output Power ..................................................................................................................... 67
5.6. RF Receiving Sensitivity .......................................................................................................... 68
5.7. Electrostatic Discharge ............................................................................................................ 68
5.8. Thermal Consideration ............................................................................................................ 69
6 Mechanical Dimensions .................................................................................................................... 72
6.1. Mechanical Dimensions of the Module.................................................................................... 72
6.2. Recommended Footprint ......................................................................................................... 74
6.3. Renderings of the Module ....................................................................................................... 75
7 Storage, Manufacturing and Packaging .......................................................................................... 76
7.1. Storage .................................................................................................................................... 76
7.2. Manufacturing and Soldering .................................................................................................. 77
7.3. Packaging ................................................................................................................................ 79
8 Appendix References ........................................................................................................................ 80