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Quectel LTE-A Series - Page 74

Quectel LTE-A Series
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LTE-A Module Series
EG060V-EA Hardware Design
EG060V-EA_Hardware_Design 73 / 82
Figure 42: Bottom Dimensions (Bottom View) of the Module
The package warpage level of the module conforms to JEITA ED-7306 standard.
NOTE

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