Quectel LTE-A Series - Page 79

LTE-A Module Series
EG060V-EA Hardware Design
EG060V-EA_Hardware_Design 78 / 82
Temp. (°C)
Reflow Zone
Soak Zone
246
200
220
238
C
D
B
A
150
100
Max slope: 1~3 °C/s
Cooling down slope:
-1.5 ~ -3 °C/s
Max slope:
2~3 °C/s
Figure 46: Recommended Reflow Soldering Thermal Profile
Table 37: Recommended Thermal Profile Parameters
Factor
Recommendation
Soak Zone
Max slope
1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70–120 s
Reflow Zone
Max slope
2–3 °C/s
Reflow time (D: over 220°C)
45–70 s
Max temperature
238 °C to 246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle
1