Sony HCD-XG80 User Manual

SERVICE MANUAL
Amplifier section
AEP, UK models:
DIN power output (rated) 200 + 200 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
250 + 250 watts
(6 ohms at 1 kHz, 10% THD)
Music power output (reference)
430 + 430 watts
(6 ohms at 1 kHz, 10% THD)
Other models:
The following measured at AC 120/220/240V, 50 Hz
DIN power output (rated) 240 + 240 watts
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
320 + 320 watts
(4 ohms at 1 kHz, 10% THD)
VIDEO IN:
(phono jacks) sensitivity 250 mV,
impedance 47 kilohms
Inputs
DJ MIX*:
(phono jacks) sensitivity 250 mV,
impedance 47 kilohms
GUITAR IN:
(phone jack) sensitivity 75 mV,
impedance 470 kilohms
PHONO IN:
(phono jacks) sensitivity 3 mV,
impedance 47 kilohms
MIX MIC:
(phone jack) sensitivity 1 mV,
impedance 10 kilohms
GAME IN:
(phono jacks) sensitivity 250 mV,
impedance 47 kilohms
MD IN:
(phono jack) sensitivity 450 mV,
impedance 47 kilohms
Outputs
DJ MIX*:
(phono jacks) sensitivity 250 mV,
impedance 1 kilohms
PHONES:
(stereo phone jack) accepts headphones of 8
ohms or more
VIDEO OUT:
(phono jack) voltage 250 mV
impedance 1 kilohm
MD OUT:
(phono jacks) voltage 250 mV
impedance 1 kilohm
FRONT SPEAKER:
HCD-XG80: accepts impedance of 4 to
16 ohms
HCD-XG700:
accepts impedance of 6 to
16 ohms
* AEP, UK and Mexican models only
CD player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=780nm), Emission
duration: continuous
Wavelength 780 – 790 nm
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Signal-to-noise ratio More than 90 dB
Dynamic range More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength: 660 nm
Output level –18 dBm
Tape player section
Recording system 4-track 2-channel stereo
Frequency response 40 – 13,000 Hz (±3 dB),
(DOLBY NR OFF)
using Sony TYPE I cassette
40 – 14,000 Hz (±3 dB),
using Sony TYPE II cassette
COMPACT DISC DECK RECEIVER
AEP Model
UK Model
HCD-XG700
E Model
HCD-XG80
SPECIFICATIONS
HCD-XG80/XG700
Photo: HCD-XG80
Ver 1.0 2001.03
9-929-596-11 Sony Corporation
2001C0500-1 Audio Entertainment Group
C 2001.3 General Engineering Dept.
HCD-XG80/XG700 is the amplifier, CD
player, tape deck and tuner section in
LBT-XG80/XG700.
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol ; are trade-
marks of Dolby Laboratories Licensing Corporation.
Model Name Using Similar Mechanism HCD-LX6/LX50/LX70
CD
CD Mechanism Type CDM37M-5BD32L
Section
Base Unit Name BU-5BD32L
Optical Pick-up Name KSS-213DH
TAPE
Model Name Using Similar Mechanism NEW
Section
Tape Transport Mechanism Type TCM-230PWR42
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Sony HCD-XG80 Specifications

General

Brand	Sony
Model	HCD-XG80
Category	Stereo System
Language	English

Summary

SPECIFICATIONS

Amplifier section

Details on power output and input sensitivity for various models.

CD player section

Laser wavelength, frequency response, S/N ratio, and dynamic range.

Tape player section

Recording system, frequency response for tape playback.

SECTION 2 GENERAL

Tuner section

FM/AM superheterodyne tuner specifications, tuning ranges, and frequencies.

Notes on chip component replacement

Precautions for handling and replacing chip components.

Flexible Circuit Board Repairing

Guidelines for repairing flexible circuit boards, including soldering temperature.

SECTION 3 DISASSEMBLY

3-1. DISASSEMBLY FLOW

Step-by-step outline for disassembling the unit.

3-2. CASE

Procedure for removing the outer case of the unit.

3-3. FRONT PANEL SECTION

Steps to disassemble the front panel assembly.

SECTION 1 SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

Precautions for handling the optical pick-up to prevent electrostatic damage.

NOTES ON LASER DIODE EMISSION CHECK

Safety and procedural notes for checking the laser diode emission.

LOCATION OF CONTROLS - Front Panel -

BUTTON DESCRIPTIONS

Explains the function of various buttons on the unit.

Rear Panel

Remote control

Setting the time

SECTION 4 TEST MODE

[MC Cold Reset]

Procedure to clear all data and reset the set to initial conditions.

[MC Hot Reset]

Resets the set while retaining preset data, similar to power cycling.

[CD Delivery Mode]

Moves the optical pick-up to a safe position for shipping or handling.

SECTION 5 MECHANICAL ADJUSTMENTS

Torque Measurement

Table listing modes, torque meter readings, and meter readings.

SECTION 6 ELECTRICAL ADJUSTMENTS

DECK SECTION

Specifies the adjustment range for the deck section.

Test Tape

Lists test tapes and their uses for adjustments.

Record/Playback Head Azimuth Adjustment

Tape Speed Adjustment DECK B

Playback Level Adjustment DECK A DECK B

REC Bias Adjustment DECK B

REC Level Adjustment DECK B

CD SECTION

S-Curve Check

Procedure for performing and checking the S-curve waveform.

E-F Balance (1 Track Jump) Check

How to check E-F balance using a 1-track jump waveform.

RF Level Check

Procedure for checking the RF signal level using an oscilloscope.

SECTION 7 DIAGRAMS

7-1. BLOCK DIAGRAM - CD SERVO Section -

Block diagram illustrating the CD servo system circuit.

7-2. BLOCK DIAGRAM - TUNER/TAPE DECK Section -

7-3. BLOCK DIAGRAM - MAIN Section -

7-4. BLOCK DIAGRAM - DISPLAY/KEY CONTROL/POWER SUPPLY Section -

7-5. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Circuit Boards Location

Diagram showing the physical location of various circuit boards.

7-6. PRINTED WIRING BOARD - BD Board -

7-7. SCHEMATIC DIAGRAM - BD Board -

7-8. PRINTED WIRING BOARDS - CD MOTOR Section -

7-9. SCHEMATIC DIAGRAM - CD MOTOR Section -

7-10. PRINTED WIRING BOARD - AUDIO Board -

7-11. SCHEMATIC DIAGRAM - AUDIO Board -

7-12. PRINTED WIRING BOARD - LEAF SW Board -

7-13. SCHEMATIC DIAGRAM - LEAF SW Board -

7-14. SCHEMATIC DIAGRAM - MAIN Board (1/3) -

7-15. SCHEMATIC DIAGRAM - MAIN Board (2/3) -

7-16. SCHEMATIC DIAGRAM - MAIN Board (3/3) -

7-17. PRINTED WIRING BOARD - MAIN Board -

Waveforms

7-18. PRINTED WIRING BOARD - PA Board -

7-19. SCHEMATIC DIAGRAM - PA Board -

7-20. PRINTED WIRING BOARDS - MIC/FRONT INPUT/HEADPHONES Boards -

7-21. SCHEMATIC DIAGRAM - MIC/FRONT INPUT/HEADPHONES Boards -

7-22. PRINTED WIRING BOARD - PANEL FL Board -

7-23. SCHEMATIC DIAGRAM - PANEL FL Board -

7-24. PRINTED WIRING BOARDS - PANEL VR/ILLUMINATION Boards -

7-25. SCHEMATIC DIAGRAM - PANEL VR/ILLUMINATION Boards -

7-26. PRINTED WIRING BOARDS - TC-A/TC-B/CD-L/CD-R (1)/CD-R (2) Boards -

7-27. SCHEMATIC DIAGRAM - TC-A/TC-B/CD-L/CD-R (1)/CD-R (2) Boards -

7-28. PRINTED WIRING BOARDS - TRANSFORMER Section-

7-29. SCHEMATIC DIAGRAM -TRANSFORMER Section -

IC Block Diagrams

IC101 CXD2587Q

IC block diagram for CXD2587Q on the BD board.

IC102 BA5974FP-E2

IC block diagram for BA5974FP-E2 on the BD board.

CD MOTOR Board

- AUDIO Board -

- MAIN Board -

- PANEL FL Board -

- PANEL VR Board -

7-30. IC PIN FUNCTION DESCRIPTION

MAIN BOARD IC501 M30622MAA-A92FP (SYSTEM CONTROLLER (CD MECHANISM CONTROL))

Detailed pin function description for IC501 on the Main Board.

Pin No. Pin Name I/O Description

* Table motor (M201) control

PANEL FL BOARD IC601 TMP88CP76F-1B71 (FLUORESCENT INDICATOR TUBE DRIVER, KEY CONTROL)

Pin No. Pin Name I/O Description

SECTION 8 EXPLODED VIEWS

8-1. CASE, BACK PANEL SECTION

Exploded view and parts list for the case and back panel.

8-2. FRONT PANEL SECTION-1

8-3. FRONT PANEL SECTION-2

8-4. CHASSIS SECTION

8-5. TAPE MECHANISM DECK SECTION-1 (TCM-230PWR42)

8-6. TAPE MECHANISM DECK SECTION-2 (TCM-230PWR42)

8-7. CD MECHANISM DECK SECTION (CDM37M-5BD32L)

8-8. BASE UNIT SECTION (BU-5BD32L)

SECTION 9 ELECTRICAL PARTS LIST

AUDIO BOARD

List of electrical parts for the audio board, including ICs, capacitors, coils, transistors, and resistors.

AUDIO BD

BD CD MOTOR CD-L CD-R (1)

CD-R (2) FRONT INPUT HEADPHONES ILLUMINATION LEAF SW

LEAF SW LED MAIN

MAIN

MAIN

MAIN

MAIN

MAIN MIC PA

PA

PA

PANEL FL

PANEL FL PANEL VR

PANEL VR SUB TRANS TABLE SENSOR TC-A

TC-B TRANS

ACCESSORIES & PACKING MATERIALS

REVISION HISTORY