25
MZ-E10
r
WAVEFORMS
1
IC601 (R606) XOUT
2
IC901 qdqf L1
Note on Schematic Diagram
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise
specified.
Note on Printed Wiring Boards
• X : parts extracted from the component side.
• z : Through hole.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Main boards is six-layer pritnted board.
However, the patterns of layer 2 to 5 have not been in-
cluded in this diagrams.
• Replacement of IC501 and IC601 used in this set requires
a special tool.
• Lead Layouts
Lead layout of
conventional IC
surface
CSP (chip size package)
1.3 Vp-p
16.9344 MHz
107
Note:
The components identi-
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
• : B+ Line.
• Power voltage is dc 3.7V and fed with regulated dc power supply
from connector (CN952).
•Voltages and waveforms are dc with respect to ground under no-
signal conditions.
no mark : PLAY
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
• Circled numbers refer to waveforms.
• Signal path.
F : Analog
J : Digital
*
Replacement of IC501 and IC601 used in this set requires a spe-
cial tool.
• The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different form that of conven-
tional IC.
3
IC901 efeg L2
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