3 Packages
3.1 Package summary
The package selection must take into account the constraints that are strongly dependent upon the application.
The list below summarizes the most frequent ones:
• Amount of interfaces required: Some interfaces may not be available on some packages. Some interfaces
combinations may not be possible on some packages.
• PCB technology constrains: Small pitch and high-ball density may require more PCB layers and
higher‑class PCB.
• Package height
• PCB available area
• Noise emission or signal integrity of high-speed interfaces
• Smaller packages usually provide better signal integrity. This is further enhanced as small-pitch and high-ball
density requires multilayer PCBs that allow better supply/ground distribution.
• Compatibility with other devices
Table 1. Package summary for STM32U575/585
Package
Size (mm)
(1)
Pitch (mm)
Height (mm)
(2)
Without SMPS With SMPS
UFQFN48 7 x 7 0.5 0.6 X X
LQFP48 7 x 7 0.5 1.6 X X
LQFP64 10 x 10 0.5 1.6 X X
WLCSP90 4.20 x 3.95 0.4 0.59 - X
LQFP100 14 x 14 0.5 1.6 X X
UFBGA132 7 x 7 0.5 0.6 X X
LQFP144 20 x 20 0.5 1.6 X X
UFBGA169 7 x 7 0.5 0.6 X X
1. Body size, excluding pins for LQFP.
2. Maximum value.
AN5373
Packages
AN5373 - Rev 1
page 14/37
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