LE910Cx Hardware Design Guide
1VV0301298 Rev.40 Page 107 of 149 2023-03-16
Not Subject to NDA
Cleaning with water or any organic solvent can lead to capillary effects where the
cleaning solvent is absorbed into the gap between the module and the host board
or even leaks inside the module (due to the gap between the module shield and
PCB). The combination of soldering flux residues and encapsulated solvent could
lead to short circuits between conductive parts. The solvent could also damage the
module label.
Ultrasonic cleaning could damage the module permanently. Especially for crystal
oscillators where the risk of damaging is very high.
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