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Telit Wireless Solutions LE910Cx - Solder Paste; Solder Reflow; Figure 27: Solder Reflow Profile

Telit Wireless Solutions LE910Cx
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LE910Cx Hardware User Guide
1VV0301298 Rev. 1.05 - 2017-06-18
Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved
Telit Confidential Information, provided under NDA Page
100 of 117
10.7. Solder Paste
We recommend using only “no clean” solder paste to avoid the cleaning of the modules after
assembly.
10.7.1. Solder Reflow
Figure 27 shows the recommended solder reflow profile.
Figure 27: Solder Reflow Profile

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