Telit Wireless Solutions LE910Cx - Page 8

LE910Cx Hardware User Guide
1VV0301298 Rev. 1.05 - 2017-06-18
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9.2. Indication of Software Ready ........................................................................... 91
9.3. RTC – Real Time Clock ...................................................................................... 91
9.4. VAUX Power Output ........................................................................................ 91
9.5. ADC Converter ................................................................................................. 92
9.5.1. Description............................................................................................ 92
9.5.2. Using the ADC Converter ...................................................................... 92
9.6. Using the Temperature Monitor Function ...................................................... 92
9.7. GNSS Characteristics ........................................................................................ 93
10. Mounting the Module on your Board ............................................................... 94
10.1. General ............................................................................................................. 94
10.2. Finishing & Dimensions .................................................................................... 94
10.3. Recommended Footprint for the Application ................................................. 97
10.4. Stencil ............................................................................................................... 98
10.5. PCB Pad Design ................................................................................................ 98
10.6. Recommendations for PCB Pad Dimensions (mm) .......................................... 99
10.7. Solder Paste ................................................................................................... 100
10.7.1. Solder Reflow ...................................................................................... 100
11. Application Guide ........................................................................................... 102
11.1. Debug of the LE910Cx Module in Production ................................................ 102
11.2. Bypass Capacitor on Power Supplies ............................................................. 103
11.3. SIM Interface .................................................................................................. 104
11.3.1. SIM Schematic Example ...................................................................... 104
11.4. EMC Recommendations ................................................................................. 105
11.5. Download and Debug Port ............................................................................. 106
11.5.1. Fast Boot mode................................................................................... 106
11.5.2. Recovery Boot Mode .......................................................................... 106
12. Packing System ............................................................................................... 107
12.1. Packing system – Tray .................................................................................... 107
12.2. Tape & Reel .................................................................................................... 109
12.3. Moisture Sensitivity ....................................................................................... 111