ME910C1 HW User Guide
1VV0301351 Rev.8 Page 84 of 99 2018-09-28
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer Thickness (um) Properties
Electro-less Ni /
Immersion Au
3 –7 / 0.05 – 0.15 good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-
free process. This issue should be discussed with the PCB-supplier. Generally, the
wettability of tin-lead solder paste on the described surface plating is better compared to
lead-free solder paste.
It is not necessary to panel the application’s PCB, however in that case it is suggested to
use milled contours and predrilled board breakouts; scoring or v-cut solutions are not
recommended
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
Solder paste
Item Lead Free
Solder Paste Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly
To Next Page
Loading...
Need help?
General
