Telit Wireless Solutions ME910C1 Series - 10.6. Solder Reflow

ME910C1 HW User Guide
1VV0301351 Rev.8 Page 85 of 99 2018-09-28
Solder Reflow
Recommended solder reflow profile:
Profile Feature Pb-Free Assembly Free
Average ramp-up rate (T
L
to T
P
) 3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate 3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp) 245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.