Ublox ODIN-W2 Series User Manual

ODIN-W2 series - System integration manual
UBX-14040040 - R20 Handling and soldering Page 31 of 43
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4.3 Soldering
4.3.1 Solder paste
No clean solder paste is strongly recommended for the ODIN-W2 series modules as it does not require
cleaning after the soldering process. The paste listed in Table 6 meets these criteria:
Soldering Paste OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification 95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9 % Silver / 0.6% Copper)
95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper)
Melting Temperature 217 – 220 °C
Stencil Thickness 150
μ
m for base boards
Table 6: Soldering paste information
The final choice of the solder paste depends on the approved manufacturing procedures. The paste-
mask geometry for applying solder paste should meet the recommendations in Module footprint and
paste mask section.
☞ The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC
specification.
4.3.2 Reflow soldering
A convection type-soldering oven is strongly recommended over the infrared type radiation oven. The
convection heated ovens allow precise control of the temperature and all parts will be heated up evenly
regardless of material properties, thickness of components, and surface color.
Consider the “IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave)
processes”, published during 2017. Select the reflow profiles as per the following recommendations:
⚠ Failure to observe these recommendations can result in severe damage to the device.
Controlled atmosphere
The use of nitrogen is strongly recommended for soldering ODIN-W2 “Hardware version 06” and
previous module versions.
Preheat phase
Initial heating of component leads and balls to dry out any residual humidity. Note that this preheat
phase does not replace prior baking procedures.
• Temperature rise rate: maximum 3 °C/s.
If the temperature rises too rapidly during the preheat phase it may cause excessive slumping.
• Time: 60 to 120 seconds:
If the preheat is insufficient, rather large solder balls could be generated. Conversely, if performed
excessively, fine balls and large balls will be generated in clusters.
• End Temperature: 150 °C to 200 °C:
If the temperature is too low, non-melting tends to be caused in areas containing large heat
capacity.
Heating and reflow phase
The temperature rises above the liquidus temperature of 217 °C. Avoid a sudden rise in temperature
as the slump of the paste could become worse.
• Limit time above 217 °C liquidus temperature: 40 to 60 s
• Peak reflow temperature: 245 °C

Ublox ODIN-W2 Series Specifications

General

Brand	Ublox
Model	ODIN-W2 Series
Category	Control Unit
Language	English