ODIN-W2 series - System integration manual
UBX-14040040 - R20 Handling and soldering Page 30 of 43
C1-Public
4 Handling and soldering
☞ No natural rubbers, hygroscopic materials or materials containing asbestos are employed.
4.1 Packaging, shipping, storage and moisture preconditioning
For information pertaining to the ODIN-W2 series reels/tapes, Moisture Sensitivity levels (MSL),
shipment and storage information, and drying for preconditioning, refer to
ODIN-W2 series
Data
sheet [2]
and
u-blox Package information guide
[4]
.
4.2 Handling
The ODIN-W2 series modules are Electro-Static Discharge (ESD) sensitive devices.
⚠ Ensure ESD precautions are implemented while handling the module.
The ESD is the sudden and momentary electric current that flows between two objects at different
electrical potentials caused either by direct contact or induced by an electrostatic field. The term is
usually used in the electronics and other industries to describe momentary unwanted currents that
may cause damage to the electronic equipment.
The ESD sensitivity for each pin of the ODIN-W2 series modules (as Human Body Model according to
JESD22-A114F) is specified in the
ODIN-W2 series
Data sheet [2]
.
The ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be
a small working station or a large manufacturing area. The main principle of an EPA is that there are
no highly charging materials near ESD sensitive electronics, all conductive materials are grounded,
workers are grounded, and charge build-up on ESD sensitive electronics is prevented. International
standards are used to define typical EPA and can be obtained for example, from International
Electrotechnical Commission (IEC) or American National Standards Institute (ANSI).
In addition to standard ESD safety practices, the following measures should be taken into account
while handling the ODIN-W2 series modules:
• Unless there is a galvanic coupling between the local GND (that is, the work table) and the PCB
GND, the first point of contact when handling the PCB, must always be between the local GND and
PCB GND.
• Before mounting an antenna patch, connect ground of the device.
• When handling the module, do not come into contact with any charged capacitors and be careful
when contacting materials that can develop charges (for example, patch antenna, coax cable,
soldering iron and so on).
• To prevent electrostatic discharge through the RF pin, do not touch any exposed antenna area. If
there is any risk that such exposed antenna area is touched in non ESD protected work area,
implement proper ESD protection measures in the design.
• When soldering the module, make sure to use an ESD safe soldering iron.
For more robust designs, employ additional ESD protection measures on the application device
integrating the ODIN-W2 series modules, as described in the ESD guidelines section.