Ublox ODIN-W2 Series User Manual

ODIN-W2 series - System integration manual
UBX-14040040 - R20 Appendix Page 39 of 43
C1-Public
C XMODEM code example
Example showing a basic XMODEM implementation and a CRC calculation in C#.
private const int XMODEM_ACK = 6;
private const int XMODEM_NAK = 21;
private const int XMODEM_EOT = 4;
public Boolean XModemSend(Stream inputStream)
{
byte blockCnt = 0;
Boolean result = false;
BufferedStream bufferedInput = new BufferedStream(inputStream);
byte[] block = new Byte[133];
int bytesRead;
do {
for (int i = 0; i < 133; i++) {
block[i] = 0;
}
bytesRead = bufferedInput.Read(block, 3, 128);
blockCnt++;
block[0] = 1;
block[1] = blockCnt;
block[2] = (byte)(255 - blockCnt);
ushort crc = xmodemCalcrc(block, 3, 128);
block[131] = (Byte)((crc >> 8) & 0xFF);
block[132] = (Byte)(crc & 0xFF);
try {
this.Write(block, 0, block.Length);
} catch (Exception) {
result = false;
break;
}
try {
Byte res = (Byte)this.ReadByte();
while (res == 'C') {
res = (Byte)this.ReadByte();
}
if (res == XMODEM_ACK) {
DebugPrint(“Bytes sent {0}”, bytesRead));
if (bytesRead < 128) {
byte[] eot = new byte[1];
eot[0] = XMODEM_EOT;
this.Write(eot, 0, 1);
res = (Byte)this.ReadByte();
if (res == XMODEM_ACK) {
/* File sent ok */
result = true;
} else {
result = false;
}
}
} else {
// No ACK received, stop transmission no retransmission implemented
result = false;
break;
}
} catch (TimeoutException) {
result = false;
break;
}
}
while (bytesRead == 128);
DebugPrint(“Bytes sent {0}”, bytesRead));
bufferedInput.Close();
return result;
}

Ublox ODIN-W2 Series Specifications

General

Frequency Bands	2.4 GHz, 5 GHz
Power Supply	3.3 V
Operating Temperature	-40°C to +85°C
Module Type	Standalone
Product Category	Wireless module
Wireless Technology	Bluetooth
Standards	IEEE 802.11a, IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, Bluetooth 4.2
Processor	ARM Cortex-M4
Interface	UART, SPI, USB
Security	WPA/WPA2
Certifications	FCC, CE, IC

Summary

System Description and Overview

Pin Configuration and Functions

Pin Description and Signals

Detailed description of each pin's function, signal name, and remarks.

Supply Interfaces and Power

Guidelines for connecting the module's power supply, including VCC and V_INT.

Main Power Supply Inputs

Requirements for the main VCC power supply, including voltage and current.

V_INT Supply for Digital Interfaces

Data Communication Interfaces

Overview of data interfaces like UART and Ethernet.

UART Interface Design

Details on UART signals, modes, and hardware flow control for data communication.

Ethernet RMII and SMI Interfaces

Antenna Interface Design

Information on antenna connectors and internal antenna options.

External Antenna Connectors

Describes the U.FL connectors for external antennas on the ODIN-W260.

Internal Antenna Details

Software Integration and Flashing

Flashing u-blox Connectivity Software

Instructions for updating the module's firmware using different methods.

Firmware Update via s-center

Step-by-step guide for firmware updates using the s-center evaluation software.

Firmware Update via AT Command

Procedure for updating firmware via AT commands and XMODEM protocol.

Firmware Update via Rescue Mode

Method for flashing firmware using rescue mode via grounding specific pins.

Flashing the u-blox Bootloader

Procedures for reflashing the module's bootloader.

Bootloader Flashing via ROM

Bootloader Flashing via SWD/JTAG

Flashing Arm Mbed Applications

Mbed Application Flashing via ROM

Mbed Application Flashing via SWD/JTAG

Design-In Guidelines and Best Practices

Antenna Interface Design

Recommendations for designing antenna interfaces, considering placement and interference.

External Antenna Connector Design

Internal Antenna Placement

Power Supply Interface Design

Design considerations for the module's power supply connections.

Module Power Supply Design

Best practices for connecting the VCC pin for optimal RF performance.

V_INT Supply for External Interfaces

Data Communication Interface Design

UART Interface Design Considerations

Ethernet RMII/SMI Interface Design

High Speed Layout Guidelines

Best practices for laying out high-speed signal buses.

Schematic & Floor-Planning

Module Placement Best Practices

Guidelines for optimal module placement on the PCB to improve RF performance.

Layout and Manufacturing Guidelines

Best practices for PCB layout, including signal integrity and manufacturing.

Module Footprint and Paste Mask

Details on the suggested footprint and paste mask layout for the module.

Thermal Management Guidelines

Recommendations for managing heat dissipation and ensuring component longevity.

Thermal Protection Mechanisms

Describes the module's built-in thermal protection mechanisms.

Heat Dissipation Strategies

Strategies for efficient heat dissipation from the module to the host board.

ESD Protection Guidelines

Essential guidelines for implementing ESD protection on the interface board.

Example Schematic for ODIN-W2

Handling and Soldering Procedures

ESD-Sensitive Module Handling

Precautions for handling ESD-sensitive modules and establishing protective areas.

Soldering Recommendations

Detailed instructions and recommendations for soldering the module.

Solder Paste Selection and Application

Convection Reflow Soldering

Guidelines for convection reflow soldering, including preheat and reflow phases.

Qualifications, Approvals, and Testing

Product Testing Overview

OEM Manufacturer Production Test

Go/No-Go Tests for Integrated Devices