Ublox SARA-G450 Series - Page 87

SARA-G450 - System integration manual
UBX-18046432 - R08 Design-in Page 87 of 143
C1-Public
2.5.1.3 Guidelines for single SIM chip connection
An application circuit for the connection to a single solderable SIM chip (M2M UICC Form Factor) is
described in Figure 44, where the optional SIM detection feature is not implemented (see the circuit
described in Figure 45 if the SIM detection feature is required).
Follow these guidelines connecting the module to a solderable SIM chip without SIM presence
detection:
 Connect the UICC / SIM contact C1 (VCC) to the VSIM pin of the module.
 Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.
 Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.
 Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.
 Connect the UICC / SIM contact C5 (GND) to GND.
 Provide a 1 µF bypass capacitor (e.g. Murata GRM155R70J105K) at the SIM supply line (VSIM)
close to the related pad of the SIM chip, to prevent digital noise.
 Provide a bypass capacitor of about 22 pF to 33 pF (e.g. Murata GRM1555C1H330J) on each SIM
line (VSIM, SIM_CLK, SIM_IO, SIM_RST), to prevent RF coupling especially in case the RF antenna
is placed closer than 10 – 30 cm from the SIM chip.
 Limit capacitance and series resistance on each SIM signal (SIM_CLK, SIM_IO, SIM_RST) to
match the requirements for the SIM interface regarding maximum allowed rise time on the lines.
1:1 scaling
41
VSIM
39
SIM_IO
38
SIM_CLK
40
SIM_RST
4
V_INT
42
SIM_DET
SIM CHIP
SIM chip
bottom view
(contacts side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3 C5
U1
C4
2
8
3
6
7
1
C1 C5
C2 C6
C3 C7
C4 C8
8
7
6
5
1
2
3
4
TP
SARA-G450
Figure 44: Application circuit for the connection to a single solderable SIM chip, with SIM detection not implemented
Reference
Description
Part number – Manufacturer
C1, C2, C3, C4
33 pF capacitor ceramic C0G 0402 5% 50 V
GRM1555C1H330JA01 – Murata
C5
1 µF capacitor ceramic X7R 0402 10% 16 V
GRM155R70J105KA12 – Murata
U1
SIM chip (M2M UICC Form Factor)
Generic manufacturer
Table 29: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented