6 Hardware characteristics
6.1 Hardware
The following tables lists the SYS 600C hardware specifications.
Table 6.1: Hardware specifications
Intel® Core 2 Duo 2.2GHz (T7400)CPU
Intel® 82945GM and ICH7RChipset
2GB DDR2Memory
Intel® 82945 chipset integrated graphic controllerVGA
Award BIOSBIOS
30GB SSD (default), 60GB SSD (optional)Storage device
3 x PCI v2.3 slotsExpansion slot
16 x RS232 at rear panelSerial ports
Option 1: 2 x RJ45 + 4 x LC (LC 1GB only)LAN ports
Option 2: 6 x RJ45
2 x USB at rear panelUSB 2.0
1 x USB at front panel
1 x USB internal
AC97 2.1Audio
PS/2Keyboard/Mouse
SYS 600C uses the optical industrial grade SFP connector module FTM-
8012C-SLiG from Source Photonics (Fiberxon).
LC module data
Module details: Data rate 1250Mb/s, wavelength 850nm, multimode,
temperature range -40°C ~ +85°C (-40°F ~ 185°F)
88 - 132 VAC / 45 - 160 VDCPower supply
176 - 264 VAC / 200 - 370 VDC
AC Power supply frequency range is 47-63Hz
Redundant power supply is optional
110VDC, 0.3APower supply supervi-
sion contact
220VDC, 0.1A
60W max.Power consumption
60W max.Heat production
35
SYS 600C 2.93
MicroSCADA Pro
Product Guide
1MRS757729
16.11.2012Issued:
A/16.11.2012Version:
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