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APPENDIX A - THROUGH-HOLE MOUNT OPTION
The Through-Hole Mount option for the SCF drive allows the drive to be mounted with the heatsink
outside of the enclosure for better heat dissipation. This is done by using a special heatsink that
mounts to the outside of the enclosure. The drive (which has a flat plate instead of a heatsink) is
mounted to the heatsink from the inside of the enclosure. This requires cutting a hole in the enclosure
that is slightly smaller than the heatsink. Up to NEMA 4X can be achieved with this option. Panel
cutout and mounting hole dimensions are provided below for the different drive sizes.
NOTE 1: The temperature inside the enclosure must be maintained at 50°C or less, and the ambient
temperature outside of the enclosure must be 40°C or less. Refer to Section 5.0 - SCF RATINGS for
heat loss information.
NOTE 2: Cutout view is shown from the drive side (inside) of the panel.
THROUGH-HOLE DRAWING FOR MODELS UP TO 10 HP
HEATSINK
0.24
0.22
0.95
PANEL
CUTOUT
0.63
0.95
W
H
AB
E
A
MOUNTING
HOLES (#8)
0.63
E
F
F
J
K
KJ
B
C
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