Rockwell Automation Publication 8720MC-RM001K-EN-P - September 2018 45
Connect the 8720MC-RPS Unit Chapter 5
Ground Multiple Subpanels
In this figure, the chassis ground is extended to multiple subpanels.
Figure 21 - Subpanels Connected to a Single Ground Point
High-frequency (HF) bonding is not illustrated. For HF bonding information,
refer to Bonding Multiple Subpanels
on page 21.
Follow NEC and applicable
local codes.
Bonded Ground Bus
Ground Grid or Power
Distribution Ground
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