Bose Sub2 User Manual

29
DISASSEMBLY PROCEDURE
Figure 4. I/O Panel Screws Removal
Sub2 Power Stand Procedures
CAUTION: The SMD integrated circuits used
on the Main-I/O Board are extremely sensitive
to ESD damage. Be sure to use an approved
and tested ESD strap that is properly grounded
to your work bench before attempting disas-
sembly or repair of the Sub2 Powered Bass
Module.
1. I/O Panel Assy Removal
1.1 Remove the 14 screws securing the
I/O Panel Assy as indicated in Figure 4.
Note: Be careful to not cause cosmetic
damage to the unit.
1.2 Incline the Power stand to let the I/O
panel assy go downwards.
1.3 Remove the green adhesive with IPA
(Isopropyl alcohol) from the 1 cable's
connections as red arrow indicated in Figure
5.
1.4 Disconnect the cable 1 that are attaching
the Woofer. Figure 5.
2. Power-Amp Board Removal
2.1 Perform procedure 1.
2.2 On the front of the I/O panel assy, remove
the 6 screws as indicated in Figure 6 (left) and
turn it over to remove the 3 screws securing
the Power-Amp board. Figure 6 (right).
2.3 Detach 2 cables' connections as red arrow
indicated in Figure 6 (right).
Re-assembly Note: The old Heat Sink ther-
mal grease must be removed with isopropyl
alcohol and the new thermal grease, GAP
FILLER, THERMAL, part number 749859-
0020 MUST be used during board replace-
ment. Failure to use the correct thermal
grease WILL cause thermal failures. Figure 7.
Figure 5. Green Adhesive & Cable Removal
Figure 6. Power-Amp Board Screws Removal
Figure 7. Heat Sink Thermal Grease

Bose Sub2 Specifications

General

Material	EVA (Ethylene Vinyl Acetate)
Case type	Trolley case
Closure type	Zipper
Suitable for	Subwoofer
Product color	Black
Carrying handle(s)	Yes
Surface coloration	Monochromatic
Brand compatibility	Bose
Number of records (max)	-

Weight and Dimensions

Width	- mm