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General| Brand | Bose |
|---|---|
| Model | L1 II |
| Category | Control Unit |
| Language | English |
Details the warranty coverage for the Power Stand, Radiator, and Bass Module.
Provides physical dimensions for the Cylindrical Radiator, Power Stand, and Bass Module.
Lists the weight specifications for each component of the system.
Details the available input and output connectors on the power stand.
Outlines electrical performance parameters like impedance and frequency response.
Specifies electrical characteristics for the power amplifier stages.
Lists resistors used on the Input/Output PCB, with reference designators and values.
Continues the list of resistors for the Input/Output PCB.
Lists capacitors used on the Input/Output PCB, with reference designators and values.
Continues the list of capacitors for the Input/Output PCB.
Continues the list of capacitors for the Input/Output PCB.
Continues the list of capacitors for the Input/Output PCB.
Continues the list of capacitors for the Input/Output PCB.
Continues the list of capacitors for the Input/Output PCB.
Continues the list of capacitors for the Input/Output PCB.
Lists inductors used on the Input/Output PCB.
Lists diodes used on the Input/Output PCB.
Lists transistors used on the Input/Output PCB.
Lists integrated circuits used on the Input/Output PCB.
Continues the list of integrated circuits for the Input/Output PCB.
Lists miscellaneous components for the Input/Output PCB.
Lists resistors used on the Power Amplifier PCB.
Continues the list of resistors for the Power Amplifier PCB.
Continues the list of resistors for the Power Amplifier PCB.
Lists capacitors used on the Power Amplifier PCB.
Continues the list of capacitors for the Power Amplifier PCB.
Continues the list of capacitors for the Power Amplifier PCB.
Lists inductors used on the Power Amplifier PCB.
Lists diodes used on the Power Amplifier PCB.
Continues the list of diodes for the Power Amplifier PCB.
Lists transistors used on the Power Amplifier PCB.
Lists integrated circuits used on the Power Amplifier PCB.
Lists miscellaneous components for the Power Amplifier PCB.
Lists miscellaneous components for the AC Primary PCB.
Details procedures for disassembling the L1 Model II Power Stand.
Steps to remove the leg assembly from the power stand.
Steps to remove the input/output panel assembly.
Steps to remove the AC Input PCB from the power stand.
Steps to remove the DSP PCB from the power stand.
Steps to remove the amplifier boards from the power stand.
Steps to remove the cooling fan from the power stand.
General procedures for disassembling the line array sections.
Steps to remove the grille from the upper line array section.
Steps to remove the driver from the line array baffle.
Steps to remove the top end cap of the upper line array.
Steps to remove the bottom end cap of the upper line array.
Steps to remove the top end cap of the lower line array.
Steps to remove the bottom end cap of the lower line array.
Details procedures for disassembling the bass module.
Steps to remove the grille from the bass module.
Steps to remove the Bose logo from the bass module grille.
Steps to remove the woofer from the bass module.
Steps to remove the input panel from the bass module.
Overview of tests for the L1 Model II Power Stand.
Procedure to test Total Harmonic Distortion plus Noise for the line array amp.
Procedure to measure output noise level for the line array amplifier.
Procedure to test THD+N for the bass module amplifier.
Tests the bass line output functionality and muting behavior.
Tests the system's audio output across a frequency range.
Tests the ToneMatch port connection and T1 Audio Engine operation.
Mandatory electrical safety test to check for shock hazards.
Ensures proper ground connection integrity for electrical safety.
Outlines tests specific to the L1 Model II Line Array.
Checks for air leaks around the line array enclosure and grille.
Checks for extraneous noises from the line array transducer.
Verifies the correct phase of the line array transducer drivers.
Tests the line array system's response to frequency sweeps.
Outlines tests specific to the B1 Bass Module.
Checks for extraneous noises from the bass module transducer.
Instructions for building custom test cables for the power stand.
Details parts and assembly for the power stand boot test cable.
Details parts and assembly for the line input test cable.
Details parts and assembly for the bass amplifier output test cable.
Instructions for building custom test cables for line array sections.
Guide for updating the EQ and firmware of the L1 Model II Power Stand.
General description of the L1 Model II power stand's design.
Explains the role and connections of the Digital Signal Processor PCB.
Details the connectors, signal paths, and controls on the power stand.
Explains the meaning of the Power/Fault and Signal/Clip indicators.
Illustrates the audio processing chain from input to output.
Describes DSP control over amplifiers and fan operation.
Covers amplifier board architecture, variants, DC power, and input filtering.
Details the DC-to-DC converter and its operating frequency.
Explains the amplifier's gain, power output, and configuration.
Illustrates how output power is limited by zobel shutdown based on frequency.
Summarizes the different protection mechanisms and their detection methods.
Explains the function and connectivity of the B1 Bass Module.
Shows the topside layout and etch pattern of the AC Input PCB.
Shows the topside layout and etch pattern of the DSP PCB.
Shows the bottom silk screen and internal layer 1 of the DSP PCB.
Shows the bottom silk screen and internal layer 2 of the DSP PCB.
Shows the bottom silk screen and etch pattern of the DSP PCB.
Shows the topside layout and etch pattern of the Amplifier/SMPS PCB.
Shows the internal layer 1 layout and etch pattern of the Amplifier/SMPS PCB.
Shows the internal layer 2 layout and etch pattern of the Amplifier/SMPS PCB.
Shows the bottom layout and etch pattern of the Amplifier/SMPS PCB.
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