Bose Sub2 User Manual

31
DISASSEMBLY PROCEDURE
Figure 13. Fire Box Screws Removal
Figure 14. 4 Jacks Screws & Level Knob
Removal
2.7 Remove the 10 screws that secure the
Power-Amp board as indicated in Figure 12.
2.8 Remove the Heatsink from the PCBA.
Re-assembly Note:
The old power amp IC thermal grease must be
removed with isopropyl alcohol and the new
thermal grease, GAP FILLER, THERMAL, part
number 749859-0020 MUST be used during
board replacement.
The old Heatsink must be reused with the new
PCBA.
3. Main-I/O Board Removal
3.1 Perform step 2.
3.2 On the Fire box, remove the 7 screws
that secure the Main-I/O board as indicated in
Figure 13.
3.3 On the front of I/O panel assy, remove the
8 screws securing the 4 Jacks and Level Knob
as red arrow indicated in Figure 14.
3.4 Lift the Fire box up and remove the 4
screws securing the Main-I/O board. Figure15.
Re-assembly Note:
There are no Device ID concerns when re-
placing the main board. The Device ID is
assigned at the factory. Service replacement
Main-I/O PCBA’s use the PCBA serial num-
ber instead of the system serial number. As a
result, the system serial number will not show
up in the L1 Mix app.
Figure 15. Main-I/O Board Screws Removal
Figure 12. Power-Amp Board Screws Removal

Bose Sub2 Specifications

General

Material	EVA (Ethylene Vinyl Acetate)
Case type	Trolley case
Closure type	Zipper
Suitable for	Subwoofer
Product color	Black
Carrying handle(s)	Yes
Surface coloration	Monochromatic
Brand compatibility	Bose
Number of records (max)	-

Weight and Dimensions

Width	- mm