HP 280 G1 User Manual

Heat sink
CAUTION: The bond between the heat sink and the processor may be very tight.
If the computer will power on, before removing the heat sink, turn on the computer until it warms the heat
sink. Warming the heat sink lessens the bond between the heat sink and the processor, thereby making
separating them easier.
Make sure not to pull the processor out of the socket when you lift the heat sink, especially if you cannot
warm the heat sink prior to removal. Inadvertently removing the processor can damage the pins.
1. Prepare the computer for disassembly (Preparation for disassembly on page 21).
2. Remove the access panel (
Access panel on page 22).
3. Loosen the four silver captive Torx T15 screws (1) that secure the heat sink to the system board.
CAUTION: Remove heat sink retaining screws in diagonally opposite pairs (as in an X) to even the
downward forces on the processor. The pins on the socket are very fragile and any damage to them may
require replacing the system board.
4. Disconnect the fan cable from the system board connector labeled CPUFAN (2).
5. Lift the heat sink from atop the processor.
When reinstalling the heat sink, make sure that its bottom has been cleaned with an alcohol wipe and fresh
thermal grease has been applied to the top of the processor.
CAUTION: Heat sink retaining screws should be tightened in diagonally opposite pairs (as in an X) to evenly
seat the heat sink on the processor. This is especially important as the pins on the socket are very fragile and
any damage to them may require replacing the system board.
Heat sink 39

HP 280 G1 Specifications

General

Tcase	72 °C
Bus type	DMI
Stepping	C0
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	G3250
System bus rate	5 GT/s
Processor family	Intel Pentium G
Processor series	Intel Pentium G3000 series for Desktop
Processor socket	LGA 1150 (Socket H3)
Processor codename	Haswell
Number of QPI links	0
Processor frequency	3.2 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	53 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1333 MHz
Memory bandwidth supported by processor (max)	21.3 GB/s
Maximum internal memory supported by processor	32 GB
Operating system installed	Windows 7 Professional
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1600 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 4 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	-
Total storage capacity	500 GB
Product type	PC
Motherboard chipset	Intel® H81
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	11.1
On-board graphics card dynamic frequency (max)	1100 MHz
Number of displays supported (on-board graphics)	3
Power supply	180 W
Ethernet LAN data rates	10, 1000, 100 Mbit/s
USB 2.0 ports quantity	6
Scalability	1S
Processor code	SR1K7
Processor ARK ID	83538
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.1, SSE4.2
Thermal solution specification	PCG 2013C
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	355 mm
Width	165 mm
Height	358.8 mm
Weight	7050 g