4. The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with
the heat sink and system board spare part kits.
Thermal pads are used on the heat sink (2), (4) and system board (3). Thermal grease is used on the
system board component shown by callout (1) in the following image.
Reverse this procedure to replace the heat sink.
Component replacement procedures 57
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