6. Remove the heat sink (4).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink and system board spare part kits.
On computer models equipped with a graphics subsystem with discrete memory: Thermal paste is used on
the processor (1) and the heat sink section (2) that services it. Thermal paste is also used on the VGA
component (3) and the heat sink section (4) that services it.
54 Chapter 5 Removal and replacement procedures
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