HP Pro 3330 Microtower User Manual

Operating Guidelines
To prevent overheating and to help prolong the life of the computer:
●
Keep the computer away from excessive moisture, direct sunlight, and extremes of heat and
cold.
●
Operate the computer on a sturdy, level surface. Leave a 10.2-cm (4-inch) clearance on all
vented sides of the computer and above the monitor to permit the required airflow.
●
Never restrict the airflow into the computer by blocking any vents or air intakes. Do not place the
keyboard, with the keyboard feet down, directly against the front of the desktop unit as this also
restricts airflow.
●
Occasionally clean the air vents on all vented sides of the computer. Lint, dust, and other foreign
matter can block the vents and limit the airflow. Be sure to unplug the computer before cleaning
the air vents.
●
Never operate the computer with the cover or side panel removed.
●
Do not stack computers on top of each other or place computers so near each other that they
are subject to each other’s re-circulated or preheated air.
●
If the computer is to be operated within a separate enclosure, intake and exhaust ventilation
must be provided on the enclosure, and the same operating guidelines listed above will still
apply.
●
Keep liquids away from the computer and keyboard.
●
Never cover the ventilation slots on the monitor with any type of material.
●
Install or enable power management functions of the operating system or other software,
including sleep states.
Routine Care
General Cleaning Safety Precautions
1. Never use solvents or flammable solutions to clean the computer.
2. Never immerse any parts in water or cleaning solutions; apply any liquids to a clean cloth and
then use the cloth on the component.
3. Always unplug the computer when cleaning with liquids or damp cloths.
4. Always unplug the computer before cleaning the keyboard, mouse, or air vents.
5. Disconnect the keyboard before cleaning it.
6. Wear safety glasses equipped with side shields when cleaning the keyboard.
Cleaning the Computer Case
Follow all safety precautions in General Cleaning Safety Precautions on page 44 before cleaning the
computer.
44 Chapter 6 Routine Care and Disassembly Preparation

HP Pro 3330 Microtower Specifications

General

Product type	PC
Motherboard chipset	Intel® H61
Tcase	65.3 °C
Bus type	DMI
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	i3-3220
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3200 Desktop Series
Processor socket	LGA 1155 (Socket H2)
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8
Thermal Design Power (TDP)	55 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	33
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1333 MHz
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 4 GB
HDD size	3.5 \
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
Number of SSDs installed	0
Cooling type	-
On-board graphics card ID	0x152
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Recovery operating system	Windows 8 Pro
Operating system installed	Windows 7 Professional
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Processor ARK ID	65693
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal solution specification	PCG 2011C
Intel Secure Key Technology version	0.00
Intel Identity Protection Technology version	1.00
Power supply	300 W
Power supply input voltage	100 - 240 V
Power supply input frequency	50 - 60 Hz

Weight and Dimensions

Depth	421.1 mm
Width	173.2 mm
Height	382.3 mm
Weight	10000 g