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HP Pro 3330 Microtower User Manual

HP Pro 3330 Microtower
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NOTE: The system will not operate properly if you install unsupported DIMMs.
Populating DIMM Sockets
Populate the DIMM sockets in the following order: XMM1, XMM3
The system will automatically operate in single channel mode, dual channel mode, or flex mode,
depending on how the DIMMs are installed.
The system will operate in single channel mode if the DIMM sockets are populated in one
channel only.
The system will operate in a higher-performing dual channel mode if the total memory capacity
of the DIMMs in Channel A is equal to the total memory capacity of the DIMMs in Channel B.
The technology and device width can vary between the channels. If Channel A is populated with
one 1-GB DIMM and Channel B is populated with one 2-GB DIMM, the system will operate in
dual channel mode.
The system will operate in flex mode if the total memory capacity of the DIMMs in Channel A is
not equal to the total memory capacity of the DIMMs in Channel B. In flex mode, the channel
populated with the least amount of memory describes the total amount of memory assigned to
dual channel and the remainder is assigned to single channel. For optimal speed, the channels
should be balanced so that the largest amount of memory is spread between the two channels.
If one channel will have more memory than the other, the larger amount should be assigned to
Channel A. If you are populating the sockets with one 2-GB DIMM, and one 1-GB DIMM,
Channel A should be populated with the 2-GB DIMM, and Channel B should be populated with
the 1-GB DIMM. With this configuration, 2 GB will run as dual channel and 1 GB will run as
single channel.
In any mode, the maximum operational speed is determined by the slowest DIMM in the system.
The system will automatically operate in single channel mode, dual channel mode, or flex mode,
depending on how the DIMMs are installed.
Removing Memory Modules
CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power
to drain before adding or removing memory modules. Regardless of the power-on state, voltage is
always supplied to the memory modules as long as the computer is plugged into an active AC outlet.
Adding or removing memory modules while voltage is present may cause irreparable damage to the
memory modules or system board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is
important to use memory modules with gold-plated metal contacts to prevent corrosion and/or
oxidation resulting from having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before
beginning these procedures, ensure that you are discharged of static electricity by briefly touching a
grounded metal object.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage
the module.
1. Prepare the computer for disassembly (Preparation for Disassembly on page 48).
2. Remove the access panel (
Access Panel on page 49).
56 Chapter 7 Removal and Replacement Procedures – Microtower (MT) Chassis

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HP Pro 3330 Microtower Specifications

General IconGeneral
Product typePC
Motherboard chipsetIntel® H61
Tcase65.3 °C
Bus typeDMI
FSB ParityNo
Processor cache3 MB
Processor cores2
Processor modeli3-3220
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-3200 Desktop Series
Processor socketLGA 1155 (Socket H2)
Processor threads4
Processor codenameIvy Bridge
Processor frequency3.3 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurations1x16, 2x8
Thermal Design Power (TDP)55 W
Number of processors installed1
CPU multiplier (bus/core ratio)33
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor32 GB
Memory slots2x DIMM
Internal memory4 GB
Memory channelsDual-channel
Memory clock speed1333 MHz
Maximum internal memory8 GB
Memory layout (slots x size)1 x 4 GB
HDD size3.5 \
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Total storage capacity500 GB
Number of SSDs installed0
Cooling type-
On-board graphics card ID0x152
On-board graphics card modelIntel® HD Graphics 2500
On-board graphics card familyIntel® HD Graphics
On-board graphics card base frequency650 MHz
On-board graphics card dynamic frequency (max)1050 MHz
Number of displays supported (on-board graphics)3
Recovery operating systemWindows 8 Pro
Operating system installedWindows 7 Professional
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
USB 2.0 ports quantity6
Chassis typeMicro Tower
Product colorBlack
Country of originChina
Processor ARK ID65693
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX, SSE4.1, SSE4.2
Thermal solution specificationPCG 2011C
Intel Secure Key Technology version0.00
Intel Identity Protection Technology version1.00
Power supply300 W
Power supply input voltage100 - 240 V
Power supply input frequency50 - 60 Hz
Weight and Dimensions IconWeight and Dimensions
Depth421.1 mm
Width173.2 mm
Height382.3 mm
Weight10000 g

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