HP Pro 3330 Microtower User Manual

NOTE: The system will not operate properly if you install unsupported DIMMs.
Populating DIMM Sockets
Populate the DIMM sockets in the following order: XMM1, XMM3
The system will automatically operate in single channel mode, dual channel mode, or flex mode,
depending on how the DIMMs are installed.
●
The system will operate in single channel mode if the DIMM sockets are populated in one
channel only.
●
The system will operate in a higher-performing dual channel mode if the total memory capacity
of the DIMMs in Channel A is equal to the total memory capacity of the DIMMs in Channel B.
The technology and device width can vary between the channels. If Channel A is populated with
one 1-GB DIMM and Channel B is populated with one 2-GB DIMM, the system will operate in
dual channel mode.
●
The system will operate in flex mode if the total memory capacity of the DIMMs in Channel A is
not equal to the total memory capacity of the DIMMs in Channel B. In flex mode, the channel
populated with the least amount of memory describes the total amount of memory assigned to
dual channel and the remainder is assigned to single channel. For optimal speed, the channels
should be balanced so that the largest amount of memory is spread between the two channels.
If one channel will have more memory than the other, the larger amount should be assigned to
Channel A. If you are populating the sockets with one 2-GB DIMM, and one 1-GB DIMM,
Channel A should be populated with the 2-GB DIMM, and Channel B should be populated with
the 1-GB DIMM. With this configuration, 2 GB will run as dual channel and 1 GB will run as
single channel.
●
In any mode, the maximum operational speed is determined by the slowest DIMM in the system.
The system will automatically operate in single channel mode, dual channel mode, or flex mode,
depending on how the DIMMs are installed.
Removing Memory Modules
CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power
to drain before adding or removing memory modules. Regardless of the power-on state, voltage is
always supplied to the memory modules as long as the computer is plugged into an active AC outlet.
Adding or removing memory modules while voltage is present may cause irreparable damage to the
memory modules or system board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is
important to use memory modules with gold-plated metal contacts to prevent corrosion and/or
oxidation resulting from having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before
beginning these procedures, ensure that you are discharged of static electricity by briefly touching a
grounded metal object.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage
the module.
1. Prepare the computer for disassembly (Preparation for Disassembly on page 48).
2. Remove the access panel (
Access Panel on page 49).
56 Chapter 7 Removal and Replacement Procedures – Microtower (MT) Chassis

HP Pro 3330 Microtower Specifications

General

Product type	PC
Motherboard chipset	Intel® H61
Tcase	65.3 °C
Bus type	DMI
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	i3-3220
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3200 Desktop Series
Processor socket	LGA 1155 (Socket H2)
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8
Thermal Design Power (TDP)	55 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	33
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1333 MHz
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 4 GB
HDD size	3.5 \
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
Number of SSDs installed	0
Cooling type	-
On-board graphics card ID	0x152
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Recovery operating system	Windows 8 Pro
Operating system installed	Windows 7 Professional
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Processor ARK ID	65693
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal solution specification	PCG 2011C
Intel Secure Key Technology version	0.00
Intel Identity Protection Technology version	1.00
Power supply	300 W
Power supply input voltage	100 - 240 V
Power supply input frequency	50 - 60 Hz

Weight and Dimensions

Depth	421.1 mm
Width	173.2 mm
Height	382.3 mm
Weight	10000 g