HP Pro 3330 Microtower User Manual

Country-Specific Requirements
Additional requirements specific to a country are shown in parentheses and explained below.
Country Accrediting Agency Country Accrediting Agency
Australia (1)
Austria (1)
Belgium (1)
Canada (2)
EANSW
OVE
CEBC
CSA
Italy (1)
Japan (3)
Norway (1)
Sweden (1)
IMQ
METI
NEMKO
SEMKO
Denmark (1)
Finland (1)
France (1)
Germany (1)
DEMKO
SETI
UTE
VDE
Switzerland (1)
United Kingdom (1)
United States (2)
SEV
BSI
UL
1. The flexible cord must be Type HO5VV-F, 3-conductor, 0.75mm
2
conductor size. Power cord set fittings (appliance
coupler and wall plug) must bear the certification mark of the agency responsible for evaluation in the country where it
will be used.
2. The flexible cord must be Type SVT or equivalent, No. 18 AWG, 3-conductor. The wall plug must be a two-pole
grounding type with a NEMA 5-15P (15A, 125V) or NEMA 6-15P (15A, 250V) configuration.
3. Appliance coupler, flexible cord, and wall plug must bear a “T” mark and registration number in accordance with the
Japanese Dentori Law. Flexible cord must be Type VCT or VCTF, 3-conductor, 0.75 mm
2
conductor size. Wall plug
must be a two-pole grounding type with a Japanese Industrial Standard C8303 (7A, 125V) configuration.
194 Appendix D Power Cord Set Requirements

HP Pro 3330 Microtower Specifications

General

Product type	PC
Motherboard chipset	Intel® H61
Tcase	65.3 °C
Bus type	DMI
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	i3-3220
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3200 Desktop Series
Processor socket	LGA 1155 (Socket H2)
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8
Thermal Design Power (TDP)	55 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	33
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1333 MHz
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 4 GB
HDD size	3.5 \
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
Number of SSDs installed	0
Cooling type	-
On-board graphics card ID	0x152
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Recovery operating system	Windows 8 Pro
Operating system installed	Windows 7 Professional
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Processor ARK ID	65693
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal solution specification	PCG 2011C
Intel Secure Key Technology version	0.00
Intel Identity Protection Technology version	1.00
Power supply	300 W
Power supply input voltage	100 - 240 V
Power supply input frequency	50 - 60 Hz

Weight and Dimensions

Depth	421.1 mm
Width	173.2 mm
Height	382.3 mm
Weight	10000 g