HP Pro 3330 Microtower User Manual

Removing DIPs* from vinyl tray
Removing DIPs* from Styrofoam
Removing bubble pack from PCB
Packing PCBs in foam-lined box
2,000 V
3,500 V
7,000 V
5,000 V
4,000 V
5,000 V
20,000 V
11,000 V
11,500 V
14,500 V
26,500 V
21,000 V
*These are then multi-packaged inside plastic tubes, trays, or Styrofoam.
NOTE: 700 volts can degrade a product.
Preventing Electrostatic Damage to Equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the
degree of sensitivity. The following packaging and grounding precautions are necessary to prevent
damage to electric components and accessories.
●
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or
boxes.
●
Protect all electrostatic parts and assemblies with conductive or approved containers or
packaging.
●
Keep electrostatic sensitive parts in their containers until they arrive at static-free stations.
●
Place items on a grounded surface before removing them from their container.
●
Always be properly grounded when touching a sensitive component or assembly.
●
Avoid contact with pins, leads, or circuitry.
●
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or
conductive foam.
Personal Grounding Methods and Equipment
Use the following equipment to prevent static electricity damage to equipment:
● Wrist straps are flexible straps with a maximum of one-megohm ± 10% resistance in the ground
cords. To provide proper ground, a strap must be worn snug against bare skin. The ground cord
must be connected and fit snugly into the banana plug connector on the grounding mat or
workstation.
●
Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible
with most types of shoes or boots. On conductive floors or dissipative floor mats, use them on
both feet with a maximum of one-megohm ± 10% resistance between the operator and ground.
Static Shielding Protection Levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
1,500
7,500
15,000
42 Chapter 6 Routine Care and Disassembly Preparation

HP Pro 3330 Microtower Specifications

General

Product type	PC
Motherboard chipset	Intel® H61
Tcase	65.3 °C
Bus type	DMI
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	i3-3220
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3200 Desktop Series
Processor socket	LGA 1155 (Socket H2)
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8
Thermal Design Power (TDP)	55 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	33
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1333 MHz
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 4 GB
HDD size	3.5 \
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
Number of SSDs installed	0
Cooling type	-
On-board graphics card ID	0x152
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Recovery operating system	Windows 8 Pro
Operating system installed	Windows 7 Professional
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Processor ARK ID	65693
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal solution specification	PCG 2011C
Intel Secure Key Technology version	0.00
Intel Identity Protection Technology version	1.00
Power supply	300 W
Power supply input voltage	100 - 240 V
Power supply input frequency	50 - 60 Hz

Weight and Dimensions

Depth	421.1 mm
Width	173.2 mm
Height	382.3 mm
Weight	10000 g