HP ProDesk 400 G2 Quickspecs

System Memory Support
The HP ProDesk 400 G2 Business PC supports the 4th generation Intel® Core™ processor family. Based on a new PC micro-architecture,
the processor is designed for a two-chip platform consisting of a processor and Platform Controller Hub (PCH). Unlike previous
generations, the 4th generation Intel® Core™ processor includes an Integrated Memory Controller (IMC). The IMC supports DDR3/DDR3L
protocols with two independent, 64-bit wide channels each accessing one or two DIMMs.
Two channels of non-ECC DDR3/DDR3L unbuffered dual in-line memory modules (UDIMM) or DDR3/DDR3L unbuffered small
outline dual in-line memory modules (SO-DIMM) with a maximum of two DIMMs per channel
Single-channel and dual-channel memory organization modes
Data burst length of eight for all memory organization modes
Memory data transfer rates of up to 1600 MT/s; actual supported data transfer rate determined by the configured processor.
64-bit wide channels
DDR3/DDR3L system memory I/O voltage of 1.5V
Theoretical maximum memory bandwidth of:
21.3 GB/s in dual-channel mode assuming 1333 MT/s
25.6 GB/s in dual-channel mode assuming 1600 MT/s
Platform Memory Support
Microtower (MT) platforms support up to two (2) industry-standard DDR3-SDRAM DIMMs.
CAUTION: You must shut down the computer and disconnect the power cord before adding or removing memory modules. Regardless
of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged in to an active AC outlet.
Adding or removing memory modules while voltage is present may cause irreparable damage to the memory modules or system board.
NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available due to
system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.
QuickSpecs
HP ProDesk 400 G2 Microtower Business PC
Technical Specifications – Memory
DA - 14982 North America — Version 1 — May 28, 2014 Page 40

HP ProDesk 400 G2 Specifications

General

Tcase	72 °C
Bus type	DMI2
Stepping	C0
Processor cache	2 MB
Processor cores	2
Processor model	G1840
System bus rate	5 GT/s
Processor family	Intel® Celeron® G
Processor series	Intel Celeron Processor G1000 Series for Desktop
Processor socket	LGA 1150 (Socket H3)
Processor codename	Haswell
Processor frequency	2.8 GHz
Processor cache type	L2
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor operating modes	32-bit, 64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	54, 53 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1333 MHz
Memory bandwidth supported by processor (max)	21.3 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1600 MHz
Internal memory type	DDR3L-SDRAM
Memory layout (slots x size)	1 x 4 GB
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	No
Total storage capacity	500 GB
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
Maximum on-board graphics card memory	1.024 GB
On-board graphics card OpenGL version	4.3
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	11.1
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Power supply	180 W
Product type	PC
Market positioning	Business
Chassis type	Desktop
Product color	Black
Country of origin	China
Placement supported	Horizontal
Sustainability certificates	ENERGY STAR
Operating system installed	Windows 7 Professional
Operating system architecture	64-bit
Scalability	1S
Processor code	SR1VK
Processor ARK ID	80800
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.1, SSE4.2
Thermal solution specification	PCG 2013C
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00
Intel segment tagging	Enterprise, Small Business

Weight and Dimensions

Depth	358.8 mm
Width	165 mm
Height	355 mm
Weight	6500 g