HP ProDesk 400 G2 Quickspecs

Electro-magnetic
standards
Europe 2004/108/EC
USA USAFCC part 15
Approvals CE-Mark, UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC, EMV2000, USB-IF
Ergonomic compliance ISO 9241-4, TUVGS
Kit Contents Keyboard, I/O Security and Documentation CD, warranty card
HP USB PS/2 Washable Keyboard
Physical characteristics Keys 104 (US) Layout, 105 (EU) layout - depending upon country
Dimensions
(L x W x H)
17.67x 6.62 x 1.38 in (449 x 168 x 35 mm)
Weight 1.7 lb (0.77 kg) minimum
Electrical Operating voltage + 5VDC ±5%
Power consumption 50-mA maximum (with three LEDs ON)
System interface USB Type A plug connector
ESD CE level 4, 15-kV air discharge
EMI - RFI Conforms to FCC rules for a Class B computing device
Microsoft® PC 99 - 2001 Functionally compliant
Mechanical Keycaps Stepped -profile design
Switch actuation 55-g nominal peak force with tactile feedback
Switch life 20 million keystrokes
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 7 ft (2.2 m)
Microsoft PC 99 - 2001 Mechanically compliant
Environmental Acoustics 43-dBA maximum sound pressure level
Operating temperature 50° to 122° F (10° to 50° C)
Non-operating
temperature
4° to 149° F (-20° to 65° C)
Operating humidity 10% to 95% (non-condensing at ambient)
Non-operating humidity 0% to 95% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
QuickSpecs
HP ProDesk 400 G2 Microtower Business PC
Technical Specifications – Input/Output Devices
DA - 14982 North America — Version 1 — May 28, 2014 Page 51

HP ProDesk 400 G2 Specifications

General

Tcase	72 °C
Bus type	DMI2
Stepping	C0
Processor cache	2 MB
Processor cores	2
Processor model	G1840
System bus rate	5 GT/s
Processor family	Intel® Celeron® G
Processor series	Intel Celeron Processor G1000 Series for Desktop
Processor socket	LGA 1150 (Socket H3)
Processor codename	Haswell
Processor frequency	2.8 GHz
Processor cache type	L2
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor operating modes	32-bit, 64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	54, 53 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1333 MHz
Memory bandwidth supported by processor (max)	21.3 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1600 MHz
Internal memory type	DDR3L-SDRAM
Memory layout (slots x size)	1 x 4 GB
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	No
Total storage capacity	500 GB
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
Maximum on-board graphics card memory	1.024 GB
On-board graphics card OpenGL version	4.3
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	11.1
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Power supply	180 W
Product type	PC
Market positioning	Business
Chassis type	Desktop
Product color	Black
Country of origin	China
Placement supported	Horizontal
Sustainability certificates	ENERGY STAR
Operating system installed	Windows 7 Professional
Operating system architecture	64-bit
Scalability	1S
Processor code	SR1VK
Processor ARK ID	80800
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.1, SSE4.2
Thermal solution specification	PCG 2013C
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00
Intel segment tagging	Enterprise, Small Business

Weight and Dimensions

Depth	358.8 mm
Width	165 mm
Height	355 mm
Weight	6500 g