HP Spectre x360 Maintenance And Service Guide

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its
life expectancy.
CAUTION: To prevent damage to the tablet when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in
this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by
different activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
24 Chapter 4 Removal and replacement preliminary requirements

HP Spectre x360 Specifications

General

Form factor	Convertible (Folder)
Product type	Hybrid (2-in-1)
Product color	Silver
Country of origin	China
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Optical drive type	No
Card reader integrated	Yes
Total storage capacity	256 GB
Compatible memory cards	SD
Number of SSDs installed	1
Display diagonal	15.6 \
Touch technology	Multi-touch
Native aspect ratio	16:9
Speakers manufacturer	Bang & Olufsen
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.0
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Thunderbolt ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	3
Power adapter depth	134.87 mm
Power adapter width	486.92 mm
Power adapter height	357.89 mm
Power adapter weight	3968.94 g
Battery capacity	64.5 Wh
Pointing device	Touchpad
Internal memory	8 GB
Memory clock speed	1600 MHz
Memory form factor	On-board
Internal memory type	LPDDR3-SDRAM
On-board graphics card ID	1916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 520
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Sustainability certificates	EPEAT Silver, ENERGY STAR
AC adapter power	45 W
Bus type	QPI
Stepping	D1
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
Processor model	i5-6200U
System bus rate	4 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-6200 series
Processor socket	LGA 1356 (Socket B2)
Processor codename	Skylake
Configurable TDP-up	25 W
Processor frequency	2.3 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
PCI Express configurations	1x4, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.4 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2EY
Processor ARK ID	88193
Processor package size	42 X 24 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	247 mm
Width	378 mm
Height	16 mm
Weight	1823.44 g