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HP Spectre x360 Maintenance And Service Guide

HP Spectre x360
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools
and equipment.
Use conductive field service tools, such as cutters, screw drivers, and vacuums.
When fixtures must directly contact dissipative surfaces, use fixtures made only of static-
safe materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids
and Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn off power and input signals before inserting or removing connectors or test equipment.
Grounding guidelines 25

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HP Spectre x360 Specifications

General IconGeneral
Form factorConvertible (Folder)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Optical drive typeNo
Card reader integratedYes
Total storage capacity256 GB
Compatible memory cardsSD
Number of SSDs installed1
Display diagonal15.6 \
Touch technologyMulti-touch
Native aspect ratio16:9
Speakers manufacturerBang & Olufsen
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.0
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Thunderbolt ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
Power adapter depth134.87 mm
Power adapter width486.92 mm
Power adapter height357.89 mm
Power adapter weight3968.94 g
Battery capacity64.5 Wh
Pointing deviceTouchpad
Internal memory8 GB
Memory clock speed1600 MHz
Memory form factorOn-board
Internal memory typeLPDDR3-SDRAM
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Sustainability certificatesEPEAT Silver, ENERGY STAR
AC adapter power45 W
Bus typeQPI
SteppingD1
Tjunction100 °C
Processor cache3 MB
Processor cores2
Processor modeli5-6200U
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-6200 series
Processor socketLGA 1356 (Socket B2)
Processor codenameSkylake
Configurable TDP-up25 W
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency2.8 GHz
Processor operating modes64-bit
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.4 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR2EY
Processor ARK ID88193
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth247 mm
Width378 mm
Height16 mm
Weight1823.44 g

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