HP Spectre x360 Maintenance And Service Guide

Non-volatile memory usage
Non Volatile
Memory Type
Amount (Size) Does
this memory
store customer
data?
Does
this memory
retain data
when power
is removed?
What
is the purpose
of this memory?
How is data
input into
this memory?
How
is this memory
write
protected?
Real Time Clock
(RTC) battery
backed-up CMOS
configuration
memory (CMOS)
256 Bytes No Yes Stores system
date and time
and limited
keyboard
controller data.
Using the F10
Setup utility or
changing the Mic
rosoft
Windows date
and time.
This memory
is not write-
protected.
HP recommends
password
protecting the F
10 Setup utility.
Controller (NIC)
EEPROM
64 KBytes (not
customer
accessible)
No Yes Store NIC
configuration
and NIC
firmware.
Using a utility
from the NIC
vendor that can
be run from DOS.
A utility
is required to
write data to
this memory
and is available
from NIC vendor.
Writing data to
this ROM in an
inappropriate
manner will
render the NIC
nonfunctional.
Keyboard ROM 64 KBytes (not
customer
accessible)
No Yes Stores firmware
code (keyboard,
mouse, &
battery
management).
Programmed
at the factory.
Code is updated
when the system
BIOS is updated.
A utility
is required for
writing data to
this memory
and is available
on the HP websit
e. Writing data
to this ROM in an
inappropriate
manner can
render the PC
nonfunctional.
DIMM Serial
Presence Detect
(SPD)
configuration
data
256 Bytes per
memory
module, 128
Bytes
programmable
(not customer
accessible)
No Yes Stores memory
module
information.
Programmed
by the memory
vendor.
Data cannot be
written to
this memory
when the modul
e is installed in a
PC. The specific
write protection
method varies
by memory
vendor.
System BIOS 4 to 5 MBytes Yes Yes Store system
BIOS code
and PC
configuration
data.
System BIOS
code
is programmed
at the factory.
Code is updated
when the system
BIOS is updated.
Configuration
data
and settings are
input
A utility
is required for
writing data to
this memory
and is available
on the HP websit
e. Writing data
to this ROM in an
inappropriate
manner can
Non-volatile memory usage 83

HP Spectre x360 Specifications

General

Form factor	Convertible (Folder)
Product type	Hybrid (2-in-1)
Product color	Silver
Country of origin	China
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Optical drive type	No
Card reader integrated	Yes
Total storage capacity	256 GB
Compatible memory cards	SD
Number of SSDs installed	1
Display diagonal	15.6 \
Touch technology	Multi-touch
Native aspect ratio	16:9
Speakers manufacturer	Bang & Olufsen
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.0
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Thunderbolt ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	3
Power adapter depth	134.87 mm
Power adapter width	486.92 mm
Power adapter height	357.89 mm
Power adapter weight	3968.94 g
Battery capacity	64.5 Wh
Pointing device	Touchpad
Internal memory	8 GB
Memory clock speed	1600 MHz
Memory form factor	On-board
Internal memory type	LPDDR3-SDRAM
On-board graphics card ID	1916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 520
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Sustainability certificates	EPEAT Silver, ENERGY STAR
AC adapter power	45 W
Bus type	QPI
Stepping	D1
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
Processor model	i5-6200U
System bus rate	4 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-6200 series
Processor socket	LGA 1356 (Socket B2)
Processor codename	Skylake
Configurable TDP-up	25 W
Processor frequency	2.3 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
PCI Express configurations	1x4, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.4 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2EY
Processor ARK ID	88193
Processor package size	42 X 24 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	247 mm
Width	378 mm
Height	16 mm
Weight	1823.44 g