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HP Spectre x360 Maintenance And Service Guide

HP Spectre x360
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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed. Thermal paste is used on the processor (1) and the heat sink
section (2) that services it.
Reverse this procedure to install the heat sink.
Keyboard
NOTE: The keyboard spare part kit includes the keyboard cable and the keyboard backlight cable.
For use in country or region Spare part number For use in country or region Spare part number
In ash silver finish for use on all computers with model numbers 13-4100 through 13-4199:
For use in Belgium 833714-A41 For use in the Netherlands 833714-B31
For use in Canada 833714-DB1 For use in Portugal 833714-131
For use in the Czech Republic
and Slovakia
833714-FL1 For use in Russia 833714-251
For use in Denmark, Finland,
and Norway
833714-DH1 For use in Saudi Arabia 833714-171
For use in France 833714-051 For use in South Korea 833714-AD1
For use in Germany 833714-041 For use in Spain 833714-071
For use in Greece 833714-151 For use in Switzerland 833714-BG1
For use in Italy 833714-061 For use in Turkey 833714-141
For use in Japan 833714-291 For use in the United Kingdom
and Singapore
833714-031
For use in Latin America 833714-161 For use in the United States 833714-001
Keyboard 43

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HP Spectre x360 Specifications

General IconGeneral
Form factorConvertible (Folder)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Optical drive typeNo
Card reader integratedYes
Total storage capacity256 GB
Compatible memory cardsSD
Number of SSDs installed1
Display diagonal15.6 \
Touch technologyMulti-touch
Native aspect ratio16:9
Speakers manufacturerBang & Olufsen
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.0
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Thunderbolt ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
Power adapter depth134.87 mm
Power adapter width486.92 mm
Power adapter height357.89 mm
Power adapter weight3968.94 g
Battery capacity64.5 Wh
Pointing deviceTouchpad
Internal memory8 GB
Memory clock speed1600 MHz
Memory form factorOn-board
Internal memory typeLPDDR3-SDRAM
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Sustainability certificatesEPEAT Silver, ENERGY STAR
AC adapter power45 W
Bus typeQPI
SteppingD1
Tjunction100 °C
Processor cache3 MB
Processor cores2
Processor modeli5-6200U
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-6200 series
Processor socketLGA 1356 (Socket B2)
Processor codenameSkylake
Configurable TDP-up25 W
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency2.8 GHz
Processor operating modes64-bit
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.4 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR2EY
Processor ARK ID88193
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth247 mm
Width378 mm
Height16 mm
Weight1823.44 g

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