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HP Spectre x360 Maintenance And Service Guide

HP Spectre x360
100 pages
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Index
A
AC adapter, spare part numbers 21
AC adapter/battery light 10
action keys 7
antenna, location 6
audio jack board
removal 48
spare part number 48
spare part numbers 17
audio, product description 2, 3
audio-in jack 12
audio-out jack 12
B
backups 70, 75
battery
removal 29
spare part number 20, 29
BIOS
determining version 55, 59
downloading an update 56, 60
starting the Setup Utility 55
updating 55, 59
boot order, changing 74, 80
bottom cover
removal 28
spare part numbers 20, 28
buttons
power 10, 11
TouchPad 9
volume 12
Windows 12
C
cables, service considerations 23
caps lock light 8
card reader board
removal 37
spare part numbers 18, 37
chipset, product description 1
components
display 6
keys 7
left side 10
lights 8
right side 12
speakers 8
TouchPad 9
computer
major components 15
specifications 63
connectors
power 10
service considerations 23
D
deleted files, restoring 78
display assembly
removal 46
spare part numbers 46
display components 6
display panel, product description 2
display switch 6
DisplayPort 12
E
electrostatic discharge 24
equipment guidelines 26
esc key 7
external media cards, product
description 3
F
fan
removal 33
spare part numbers 20, 33
fn key 7
G
graphics, product description 1, 2
grounding guidelines 24
guidelines
equipment 26
grounding 24
packaging 25
transporting 25
workstation 25
H
HDMI port 12
HDMI-to-VGA adapter, spare part
number 21
headphone jack 12
heat sink
removal 42
spare part numbers 20, 42
HP PC Hardware Diagnostics (UEFI)
downloading 58, 62
using 61
HP Recovery Manager 79
correcting boot problems 74
starting 73
HP Recovery media
creating 71
recovery 74
HP Recovery partition
recovery 73
removing 74
J
jacks
audio-in 12
audio-out 12
headphone 12
microphone 12
K
key components 7
keyboard
removal 43
spare part numbers 16, 43
keys
action 7
esc 7
fn 7
Windows 7
Windows applications 7
L
left-side components 10
light components 8
lights
AC adapter/battery 10
caps lock 8
mute 8
90 Index

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HP Spectre x360 Specifications

General IconGeneral
Form factorConvertible (Folder)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Optical drive typeNo
Card reader integratedYes
Total storage capacity256 GB
Compatible memory cardsSD
Number of SSDs installed1
Display diagonal15.6 \
Touch technologyMulti-touch
Native aspect ratio16:9
Speakers manufacturerBang & Olufsen
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.0
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Thunderbolt ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
Power adapter depth134.87 mm
Power adapter width486.92 mm
Power adapter height357.89 mm
Power adapter weight3968.94 g
Battery capacity64.5 Wh
Pointing deviceTouchpad
Internal memory8 GB
Memory clock speed1600 MHz
Memory form factorOn-board
Internal memory typeLPDDR3-SDRAM
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Sustainability certificatesEPEAT Silver, ENERGY STAR
AC adapter power45 W
Bus typeQPI
SteppingD1
Tjunction100 °C
Processor cache3 MB
Processor cores2
Processor modeli5-6200U
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-6200 series
Processor socketLGA 1356 (Socket B2)
Processor codenameSkylake
Configurable TDP-up25 W
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency2.8 GHz
Processor operating modes64-bit
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.4 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR2EY
Processor ARK ID88193
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth247 mm
Width378 mm
Height16 mm
Weight1823.44 g

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