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HP Spectre x360 Maintenance And Service Guide

HP Spectre x360
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Equipment guidelines
Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation.
When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible straps with a
minimum of one megohm ±10% resistance in the ground cords. To provide proper ground, wear a strap
snugly against the skin at all times. On grounded mats with banana-plug connectors, use alligator clips
to connect a wrist strap.
When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps) can be
used at standing workstations and are compatible with most types of shoes or boots. On conductive
floors or dissipative floor mats, use foot straps on both feet with a minimum of one megohm resistance
between the operator and ground. To be effective, the conductive must be worn in contact
with the skin.
The following grounding equipment is recommended to prevent electrostatic damage:
Antistatic tape
Antistatic smocks, aprons, and sleeve protectors
Conductive bins and other assembly or soldering aids
Nonconductive foam
Conductive tabletop workstations with ground cords of one megohm resistance
Static-dissipative tables or floor mats with hard ties to the ground
Field service kits
Static awareness labels
Material-handling packages
Nonconductive plastic bags, tubes, or boxes
Metal tote boxes
Electrostatic voltage levels and protective materials
The following table lists the shielding protection provided by antistatic bags and floor mats.
Material Use Voltage protection level
Antistatic plastics Bags 1,500 V
Carbon-loaded plastic Floor mats 7,500 V
Metallized laminate Floor mats 5,000 V
26 Chapter 4 Removal and replacement preliminary requirements

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HP Spectre x360 Specifications

General IconGeneral
Form factorConvertible (Folder)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Optical drive typeNo
Card reader integratedYes
Total storage capacity256 GB
Compatible memory cardsSD
Number of SSDs installed1
Display diagonal15.6 \
Touch technologyMulti-touch
Native aspect ratio16:9
Speakers manufacturerBang & Olufsen
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.0
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Thunderbolt ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
Power adapter depth134.87 mm
Power adapter width486.92 mm
Power adapter height357.89 mm
Power adapter weight3968.94 g
Battery capacity64.5 Wh
Pointing deviceTouchpad
Internal memory8 GB
Memory clock speed1600 MHz
Memory form factorOn-board
Internal memory typeLPDDR3-SDRAM
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Sustainability certificatesEPEAT Silver, ENERGY STAR
AC adapter power45 W
Bus typeQPI
SteppingD1
Tjunction100 °C
Processor cache3 MB
Processor cores2
Processor modeli5-6200U
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-6200 series
Processor socketLGA 1356 (Socket B2)
Processor codenameSkylake
Configurable TDP-up25 W
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency2.8 GHz
Processor operating modes64-bit
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.4 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR2EY
Processor ARK ID88193
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth247 mm
Width378 mm
Height16 mm
Weight1823.44 g

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