3.3 Function Overview
Table 3-1 Product features
Product Features Description
Working bands HSPA+/WCDMA 2100/1900/900/850 MHz
EDGE/GPRS/GSM 1800/1900/900/850 MHz
Chipset platform Hi6758
Working
temperature
–20°C to +55°C
Storage
temperature
–40°C to +70°C
Power vo lta ge 4.75 V to 5.25 V (5 V is recommended)
Protocol WCDMA/HSPA/HSPA+ (R7)
AT commands For details, see AT Command Interface Specification.
Application
interfaces
One standard SIM card slot (3 V or 1.8 V)
USB2.0 port
Antenna interface Embedded FPC support antenna
TS-5 external antenna port
SMS Text messages in TEXT mode
Data services WCDMA CS domain: UL 64 kbps/DL 64 kbps
WCDMA/HSPA+ PS domain: DL 21 Mbps(64QAM)/UL 5.76 Mbps
HSDPA Category 14
GSM CS doma in: 9.6/14.4 kbps
GPRS: UL 85.6 kbps/DL 85.6 kbps
EDGE: only DL 236.8 kbps
Physical features Dimensions: 85 mm x 27 mm x 12.3 mm (33.5 in x 10.6 in x 4.8 in)
Weight: about 22 g
Certification CE, FCC, and GCF
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