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Contents
1. General Information ................................................................................................................ 4
1.1. Features ................................................................................................................ 4
1.2. System Specifications ........................................................................................... 5
1.3. Dimensions ........................................................................................................... 7
1.4. Module Descriptions .............................................................................................. 8
2. Installation ............................................................................................................................ 10
3. Operation .............................................................................................................................. 12
3.1. EZ code overview ................................................................................................ 12
3.2. Dispensing Coins To Low Level........................................................................... 14
3.3. Operating Function Descriptions ......................................................................... 15
3.4. Setting Function Descriptions .............................................................................. 18
3.5. Executive Setting Function Descriptions ............................................................. 39
3.6. DIP Switch Setting............................................................................................... 47
4. Harness Application .............................................................................................................. 48
4.1. List of Main Wire Harness： ............................................................................... 48
4.2. List of Wire Harness for ICT Bill Acceptor： ....................................................... 48
4.3. Wire Harness Pin Assignment for JPSTD interface ............................................. 49
4.4. Wire Harness Pin Assignment for MDB interface ................................................ 53
4.5. Wire Harness Pin Assignment for Executive & MDB Interface ............................ 57
4.6. Wire Harness Pin Assignment for Download Box ................................................ 59
5. I/O Circuit.............................................................................................................................. 60
6. Maintenance ......................................................................................................................... 63
7. Troubleshooting .................................................................................................................... 65
7.1. Error Code Messages ......................................................................................... 65
7.2. Error Handling ..................................................................................................... 66
8. Firmware Download and Upgrade Instruction ....................................................................... 80
8.1. MCU STM32 Firmware Download by FP-004 ..................................................... 80
8.2. MCU STM32 Firmware Download by IrDA Special Function ........................... 83
9. PC Tool Instruction................................................................................................................ 84
9.1. Cashfloat Setting ................................................................................................. 84
9.2. Serial Number Setting ......................................................................................... 89
10. Read Audit Data ........................................................................................................... 90
10.1. Read Audit Data by ICT MTB .............................................................................. 90
10.2. Read Audit Data by IrDA ..................................................................................... 91
11. Module Assembling Procedure .................................................................................... 92
11.1. Upper Module Disassembling: ............................................................................ 92
11.2. Recognition Module Disassembling: ................................................................... 93
11.3. Coin Discharge Module Disassembling: .............................................................. 94
12. Module Exploded Views ............................................................................................... 95
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